2007
DOI: 10.1109/led.2006.887632
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Low-Frequency Noise Characteristics in Strained-Si nMOSFETs

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Cited by 14 publications
(5 citation statements)
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“…On the other hand, the fabrication process or device architectures in strained-Si device have a strong impact on 1 / f noise performance, [8][9][10][11][12] it is difficult to observe intrinsic stress effect on low-frequency noise and conclude on the accurate 1 / f noise fluctuation model. In this paper, we proposed an efficient method to evaluate the intrinsic strain effect which use same device process and different channel length on one chip.…”
Section: Impact Of Stress-memorization Technique Induced-tensile Stramentioning
confidence: 99%
“…On the other hand, the fabrication process or device architectures in strained-Si device have a strong impact on 1 / f noise performance, [8][9][10][11][12] it is difficult to observe intrinsic stress effect on low-frequency noise and conclude on the accurate 1 / f noise fluctuation model. In this paper, we proposed an efficient method to evaluate the intrinsic strain effect which use same device process and different channel length on one chip.…”
Section: Impact Of Stress-memorization Technique Induced-tensile Stramentioning
confidence: 99%
“…However, the carrier number fluctuation cannot accurately describe the 1/f noise mechanism for strained-Si nMOSFETs without CMP. A previous report [8] has proposed that the origin of 1/f noise commonly found in strained devices needs to be considered within the unified fluctuation model which includes number fluctuations and correlated mobility fluctuations. This compact noise model is expressed by the following equation [10]:…”
Section: Resultsmentioning
confidence: 99%
“…Due to the inherent misfit dislocation in the strained-Si/SiGe structure, the 1/f noise is supposed to serve as a monitor of the interface properties and oxide traps. LF noise characteristics in strained-Si nMOSFETs have been reported and shown significant dependence on gate oxide formation [6], the growth conditions for strained-relaxed buffer (SRB) [7], strained-Si thickness and Ge concentration of SRB [8]. However, the associated behavior is assessed in terms of the carrier number or mobility fluctuations.…”
Section: Methodsmentioning
confidence: 99%
“…The impact of SRB on strained Si MOSFETs was reported in [10], which compares the noise performance of strained Si MOSFETs with different Ge content in SRB (15 %, 20 % and 28 %). This work confirms a clear trend in noise magnitude with respect to Ge concentration in the SRB: the higher the Ge concentration, the higher the level of the low frequency noise.…”
Section: Defect Characterisationmentioning
confidence: 99%