1998
DOI: 10.1063/1.121523
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Low-level copper concentration measurements in silicon wafers using trace-element accelerator mass spectrometry

Abstract: Articles you may be interested inHigh precision measurements of arsenic and phosphorous implantation dose in silicon by secondary ion mass spectrometry J.Improved secondary ion mass spectroscopy detection limits of hydrogen, carbon, and oxygen in silicon by suppression of residual gas ions using energy and ejection angle filtering J. Vac. Sci. Technol. A 15, 2542 (1997); 10.1116/1.580767 Characterizing flat panel display materials using quadrupole-based secondary ion mass spectrometry J. Vac. Sci. Technol. A 1… Show more

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Cited by 12 publications
(4 citation statements)
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“…Depth profiling of the material concentration in samples is commonly performed with secondary ion mass spectrometry (SIMS). Recently, it has also been performed with accelerator mass spectrometry (AMS) [1][2][3][4][5]. Independently of the employed method, the depth resolution depends on flat bottom craters produced by the sputter ion beam.…”
Section: Introductionmentioning
confidence: 99%
“…Depth profiling of the material concentration in samples is commonly performed with secondary ion mass spectrometry (SIMS). Recently, it has also been performed with accelerator mass spectrometry (AMS) [1][2][3][4][5]. Independently of the employed method, the depth resolution depends on flat bottom craters produced by the sputter ion beam.…”
Section: Introductionmentioning
confidence: 99%
“…The emerging positive ions with MeV energies are measured in a Faraday cup or in a detector. The TEAMS technique is proven to be more sensitive than SIMS for many elements [11][12][13].…”
Section: Introductionmentioning
confidence: 99%
“…5 The trace element accelerator mass spectrometry ͑TEAMS͒ facility in the Ion Beam Modification and Analysis Laboratory at the University of North Texas is a combination of both SIMS and AMS and may be used to measure trace amounts of stable isotopes. 6 TEAMS can detect very low levels of impurities whose presence, even in trace amounts ͑parts per billion͒, affects device performance. 7 It is difficult to quantify 75 As in a GeSi semiconductor alloy using SIMS because of molecular interferences ͑e.g., 74 GeH and 29 Si 30 Si 16 O) which have the same nominal mass as As.…”
mentioning
confidence: 99%