Low loss coupled line filters with transmission zeros in multi-layer thin film MCM-D technology

Abstract

This paper presents the design and characterization of high-performance bandpass filters with transmission zeros, integrated in a multi-layer thin-film MCM-D technology on high-resistivity Si. A mixed thin-film microstrip/coplanar waveguide transmission line has been used for the realization of the filters, as it presents lower loss than thin-film microstrip lines. The coupled line filters achieve an insertion loss of 2.3dB at 25GHz and I.7dB at 43GHz with 3dB bandwidths of 14% and 18% respectively. The use of transmission zeros provides a close in-band attenuation of more than 30dB. The used topology allows changing the center frequency and position of the transmission zeros more or less independently facilitating the design. lndex Terms -Filter, transmission Sne, transmission zeros, MCM-D.

3D Stacking Heterogeneous Integration for Devices and Modules

“…target for the module. The MCM-D coupled-line band-pass filter with transmission zero [2] not only satisfies the selectivity criterion of the frequency, but it also consumes much less space, so the coupled-line filter with transmission zero topology is chosen in this case. The modules were fabricated in the 200 mm thin film fabrication line at imec.…”

Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias

“…12 shows the photograph of a coupled-line bandpass filter with transmission zeros, centered at 30GHz. The coupling between the input and output lines, highlighted in the figure, provides transmission zeros that improve the attenuation of the filter close to the pass band without compromising the insertion loss [4]. Fig.…”

“…HRSi is an adequate alternative material that can provide these functionalities together with high performance, and therefore, a thin-film technology is being developed using HRSi (ρ>9KΩcm) as substrate material. The integration of high quality passive components and circuits on a thin-film technology on HRSi has already been demonstrated [3], [4]. In this paper, the integration of through substrate vias is demonstrated allowing the use of microstrip based passive components and circuits within the thin-film MCM-D technology platform.…”

High-resistivity silicon surface passivation for the thin-film MCM-D technology

“…Low-loss dielectrics and copper metallizations are used, and therefore, high quality integrated passives can be realized, such as TaN resistors, BCB and Ta 2 O 5 -capacitors, low loss transmission lines and high-Q inductors (integrated in metal-2). This way, RF and mm-wave highperformance passive circuits have already been demonstrated using this technology [3], [4], [5]. Flip-chip and wirebond techniques are used to incorporate active components in the designs.…”