“…Its main parameters are a typical barrier height I Ϸ 2 eV, although values in the range 0.1-8.6 eV have been reported ͑Gundlach and Hölz, 1971;Kadlec and Kadlec, 1975;Lau and Coleman, 1981;Barner and Ruggiero, 1989͒, and a dielectric constant smaller than that of bulk Al 2 O 3 ͓4.5-8.9 at 295 K ͑Bolz and Tuve, 1983͔͒. Several methods are currently utilized to fabricate high-quality ͑i.e., highly uniform and pinhole-free͒ aluminum-oxide barriers such as in situ vacuum natural oxidation ͑Tsuge and Mitsuzuka, 1997; Matsuda et al, 1999;Parkin et al, 1999;Sun et al, 2000;Zhang et al, 2001͒, oxidation in air ͑Miyazaki and Tezuka, 1995͒, and plasma oxidation ͑Moodera et al, 1995Gallagher et al, 1997;Sun et al, 1999͒, of a thin Al layer ͑typically below 2 nm͒. The latter two methods lead, in general, to higher R c values ͑of the order of several k⍀ m 2 or larger͒ with respect to natural oxidation.…”