2012
DOI: 10.1557/mrc.2012.1
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Low-temperature aqueous solution processed fluorine-doped zinc tin oxide thin-film transistors

Abstract: Novel fluorine-doped zinc tin oxide (ZTO:F) thin-film transistors (TFTs) have been fabricated using an aqueous solution process. Exploiting hydrolysis and condensation reactions in an aqueous solution process, organic-free ZTO:F thin films were fabricated at a low temperature of 250°C. The fabricated TFT device shows a field-effect mobility of 2.85 cm 2 /V s, on-to-off current ratios exceeding 10 7 , and sub-threshold swings of 0.83 V/dec. The ZTO:F TFT also displays high operational stability of ΔV th = 1.73 … Show more

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Cited by 18 publications
(33 citation statements)
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“…On the other hand, the thermal decomposition of the mixed precursor solution starts at low temperature and is gradually made by approximately 450°C to form indium zinc oxide. Since the hydrolysis and condensation reactions have already occurred in aqueous solution via the self-condensation reaction shown in equation (2), which can lower kinetic energy, the precursor continuously loses its weight11. This interpretation is confirmed in the Raman spectra of the InF 3 , ZnF 2 , and mixed precursor solution according to the heating temperature (Fig.…”
Section: Resultssupporting
confidence: 54%
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“…On the other hand, the thermal decomposition of the mixed precursor solution starts at low temperature and is gradually made by approximately 450°C to form indium zinc oxide. Since the hydrolysis and condensation reactions have already occurred in aqueous solution via the self-condensation reaction shown in equation (2), which can lower kinetic energy, the precursor continuously loses its weight11. This interpretation is confirmed in the Raman spectra of the InF 3 , ZnF 2 , and mixed precursor solution according to the heating temperature (Fig.…”
Section: Resultssupporting
confidence: 54%
“…However, the high-temperature annealing step is inevitable for oxidation and impurity removal in the solution process. Thus, the high-temperature process acts as a hurdle in the fabrication of flexible devices using the plastic film substrates, which requires processing temperature below 250°C34567891011. Many attempts have been made to lower the annealing temperature to realize flexible TFTs with high performance.…”
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confidence: 99%
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