1988
DOI: 10.1016/0042-207x(88)90431-9
|View full text |Cite
|
Sign up to set email alerts
|

Low temperature pulsed plasma deposition. Part I—a new technique for thin film deposition with complete gas dissociation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

1
5
0

Year Published

1990
1990
2002
2002

Publication Types

Select...
7
2

Relationship

0
9

Authors

Journals

citations
Cited by 19 publications
(6 citation statements)
references
References 3 publications
1
5
0
Order By: Relevance
“…At the start of each modulation pulse, a sharp peak in optical emission is seen. Similar SiH * emission peaks in pulsed plasmas have been found by Scarsbrook et al [516] and Howling et al [321]. The sharp peak was claimed to be caused by a pulse of highenergy electrons.…”
Section: Viiic Rf Modulationsupporting
confidence: 82%
“…At the start of each modulation pulse, a sharp peak in optical emission is seen. Similar SiH * emission peaks in pulsed plasmas have been found by Scarsbrook et al [516] and Howling et al [321]. The sharp peak was claimed to be caused by a pulse of highenergy electrons.…”
Section: Viiic Rf Modulationsupporting
confidence: 82%
“…In one case very high power ͑Ϸ50 kW͒ pulses are used and source gases admitted to the discharge reactor in short bursts and pumped away by very high capacity pumps. 4 The initial results appear to be very encouraging though the equipment complexity increases many folds. In the more common pulsed plasma growth experiments, rf generators of moderate power, working at 6 -13.56 MHz are amplitude modulated by a square wave.…”
Section: Thin Film and Amorphous Materials Group National Physical Labmentioning
confidence: 83%
“…For average powers below 7 W, pulsing of the PFCH glow discharge produces a plasma polymer network with a greater C F 2 content and less cross-linked ( C −CF n ) carbon than those found for corresponding CW experiments. One possible explanation for the drop in cross-linking during pulsing could be the lower substrate temperature, since a significant advantage of pulsing the fluorocarbon glow discharge is that extensive heating of the reactor walls and substrate can be avoided . The plasma sheath voltage decays rapidly, leading to a time-averaged reduction in the number and energy of positive ions bombarding the surface; hence, the substrate experiences less heating.…”
Section: Discussionmentioning
confidence: 99%