&lt;title&gt;Directly electroplated microstructure&lt;/title&gt;

Wilson, A.; Muscat, Richard; Jackson, Ian T.; Olsson-Jacques, Christina; Retchford, J. A.

doi:10.1117/12.424414

Cited by 5 publications

(4 citation statements)

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“…A few were removed during the bonding process implying that the adhesion between the Cu and Al was nearly good enough but needed some improvement. A more detailed study of the mechanical adhesion of the sensing studs [6] improved the sensor fabrication technique to give better adhesion by a factor of 3-4 for the zincate process and 6-8 for a Cu seed process. This gives sensor studs that will stay in place during the normal cure cycle.…”

Section: Abds Experiments and Resultsmentioning

confidence: 99%

“…Electroplating was performed using current control with a unit specially designed to provide 6 low current sources. Cu sensing elements were electroplated onto trial wafers using the following zincating preparation technique [6] and also a Cu seed method [ This process is adapted form a common technique used for electroplating bulk aluminum [7]. The major difference is the use of ZnO in NH 4 OH rather than NaOH since the Al being zincated here is very thin and a zincate from a NaOH solution would strip all of the Al.…”

Section: Fabrication Processmentioning

confidence: 99%

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MEMS-Based Corrosion and Stress Sensors for Non-Destructive Structural Evaluation

Morse¹,

Laskowski²,

Wilson³

2001

Proceedings of SPE Annual Technical Conference and Exhibition

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TX 75083-3836, U.S.A., fax 01-972-952-9435. AbstractA system utilizing multiple types of microsensors for monitoring corrosion, fatigue, and failure in high value structures is described. Non-destructive evaluation (NDE) techniques enabled through microelectromechanical systems (MEMS) sensor approaches allow monitoring of the occurrence and rate of corrosion under sealants coated (painted) surfaces and other inaccessible areas. Using MEMS technology it is now possible to integrate and package sensors with associated CMOS control circuitry onto a single semiconductor chip. These sensors can provide information on the presence of stress, fatigue, corrosion, and micro-crack formation in structures being monitored. This combination of data provides critical assessment of structural health, leading to predictions of failure occurring. Two types of sensor devices will be discussed, along with results from specific applications.

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Section: Abds Experiments and Resultsmentioning

confidence: 99%

Section: Fabrication Processmentioning

confidence: 99%

MEMS-Based Corrosion and Stress Sensors for Non-Destructive Structural Evaluation

Morse¹,

Laskowski²,

Wilson³

2001

Proceedings of SPE Annual Technical Conference and Exhibition

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“…Electrical pick-up studs are required to provide contact with the top metal plate as well as providing a mechanical support to ensure that the sensing studs were not contacting the top metal plate. The outer (3,10) and one inner (7) fingers were formed as the electrical pick-up studs with heights approximately 50j.tm above the 24 tm high flexi-circuit tracks. The current to the other fingers was selected to obtain sensing elements in an expected range of 20-24 tm above the track height.…”

Section: Sensor Characterizationmentioning

confidence: 99%

Adhesive bond degradation sensor

2002

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Early detection of adhesive bond degradation using sensing elements embedded within the 1OOm bond-line of aluminium epoxy adhesive joints has been demonstrated. Sensing elements of varying heights were fabricated at the ends of narrow conductors on a flexi-circuit carrier. This construction simulates the active sensing region on a patented silicon adhesive bond degradation sensor and has been used to characterize the sensing elements without the expense and time associated with fabricating the complete integrated silicon sensor. The highest elements on the flexi-circuit serve both as electrical pickup studs, providing a circuit from the flexi-circuit to the top aluminium plate, and as spacers to ensure that the shorter sensing elements do not contact the aluminium plate. The non-contacting sensing elements are thus arranged to be close to the metal/adhesive interface and are sensitive to any change in conductivity in this region due to release of ions as the interface is degraded by the environment. Accelerated ageing tests where performed on flexi-circuit sensors embedded in the bond-line of double cantilever beam specimens. The specimens where immersed in 50°C water and pre-loaded to just initiate a crack. Load on the specimen was then maintained by applying a constant load point displacement with a very low velocity to ensure that the environment would degraded the bond-line in advance of the crack front. The change of load and the conductivity measured by the sensing elements were then logged with time. The onset of bond degradation was detected approximately 10-20mm ahead of the crack tip.

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“…This implies that the adhesion between the Cu and Al is nearly good enough but needs some improvement. Another paper in this conference [9] details work to improve the adhesion of the sensing elements. …”

Section: Adhesion Of Sensing Elementsmentioning

confidence: 99%

MEMS adhesive bond degradation sensor

et al. 2001

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The problem addressed in this paper is the through-life, non-destructive monitoring of corrosion and disbonding damages in airframes. The concept presented here is to produce a MEMS smart sensor consisting of a number of small, independent, wireless sensors within the structure of the aircraft. The MEMS smart sensor can be installed during repair and in particular when the specific platform goes through a complete tear down during the Life Extension Program (LEP). The sensors are permanently installed and can be permanently monitored and contain bond degradation sensing elements and CMOS circuits. Each sensor has an independent address and can perform measurements and communicate over a true 2-wire bus to an external interface unit. US ( 09/501,798) and international (PCT/US00/03308) patent applications have been lodged for this technology.

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<title>Directly electroplated microstructure</title>

Cited by 5 publications

References 1 publication

MEMS-Based Corrosion and Stress Sensors for Non-Destructive Structural Evaluation

MEMS-Based Corrosion and Stress Sensors for Non-Destructive Structural Evaluation

Adhesive bond degradation sensor

MEMS adhesive bond degradation sensor

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