After the successful completion ofthe European program EUCLIDES'in which core competence for Extreme UltraViolet Lithography (EUVL) technology was generated, ASML (system integration), Carl Zeiss (optics), and their partners have entered the next phase ofthe program: design and realization of an exposure tool called the alpha tool (ct-tool). This tool should be completed in 2003, and will demonstrate 50-nm-node compliant imaging using full-field all-reflective four-times reducing optics, as well as high performance vacuum scanning wafer-and reticle stages. In this paper we present the status ofthe project, as well as highlight the progress in the optics development and optics contamination mitigation efforts.