2002
DOI: 10.1117/12.462850
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<title>Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages</title>

Abstract: Damage, fatigue and failure of advanced electronic packages of MEMS and related systems are often caused by their growing use under harsh environmental conditions as well as extreme temperatures. Consequently, their thermomechanical reliability becomes more and more one of the most important preconditions for adopting it in industrial applications. Various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process along with the fact that microelectronic packages are basically co… Show more

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