<title>Smart MEMS: flip chip integration of MEMS and electronics</title>

Abstract

This paper will describe a new approach to the integration of electronics with MEMS, or Smart MEMS. Flip chip solder bumping of integrated circuits is routinely used for packaging purposes and has now been extended to the placement of electronics in close proximity to MEMS devices. The flip chip approach separates the fabrication of the MEMS and electronic devices, allowing both the IC's and MEMS to be fabricated of many different substrate materials, not just single crystal silicon. The close proximity of the electronics to the MEMS devices is very desirable to improve signal to noise performance, and provide higher levels of systems integration. This new approach provides batch fabrication capability as opposed to the serial hybrid approach, without having to fabricate the electronics and MEMS on the same chip. Results on the attachment of surface micromachined structures to glass and silicon substrates will be reported.

Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

“…Environmental concerns and reliability issues have been the main drive [1]- [3]. In the last few years, other topics appeared which again increased the impetus to develop fluxless soldering techniques: The assembly of micromachined [4], [5] and photonic devices [6], [7] and low cost flip-chip (FC) solder bonding on organic substrate materials [8], [9].…”

Integrating MEMS and ICs

“…MEMS IC 22 , micro-opto-electro-mechanical system [23][24][25] and MEMS sensors 26,27 , and a general study investigating various MEMS test structures has been reported 28 . More recent concepts for chip-to-chip and chip-to-package interconnections have been developed based on thin-film interconnects between embedded chips [29][30][31][32][33] .…”

“…While wire bonds serve merely as electrical interconnects, flip-chip bonds can double as physical chip attachments and electrical interconnects. Several concepts for MEMS and IC integration through flip-chip bonding are being used in applications such as RF-MEMS 22 , micro-opto-electro-mechanical system [23][24][25] and MEMS sensors 26,27 , and a general study investigating various MEMS test structures has been reported 28 . More recent concepts for chip-to-chip and chip-to-package interconnections have been developed based on thin-film interconnects between embedded chips [29][30][31][32][33] .…”

Piezoresistive accelerometers for MCM-package - Part II:The packaging

“…As an alternative to monolithic fabrication of microelectromechanical systems (MEMS), hybrid integration of electronics and sensors in an MCM has been proven possible [1]- [3]. However, special structural constrains of the sensors Manuscript must be properly addressed [4]. According to our strategy, the efforts have been focused on the co-design of the sensor and the package.…”