Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes

“…The oxide film on the solder surface is expected to keep stable once formed since PBR of Sn is equal to 1.19 [4]. This can be verified by the results reported by Kuhmann et al [15] who investigated the oxidation kinetics of eutectic solder alloys. Fig.…”

“…The AES profiles results indicate that the oxide thickness on the surface of the solder powders is significantly reduced by about 50%. In addition, according to the research reported by Kuhmann et al [15], the growth of the oxide depends on temperatures as well as on O 2 partial-pressures. Therefore, the oxide thinning process offers a possibility to control the oxide thickness, which is of great significance for the performance of solder pastes.…”

“…After the reaction, the solder powders were filtrated and then dried in vacuum oven (P total < 60 Pa) for 24 h. Finally, the solder powders were exposed to the air at ambient temperature for 15 days to guarantee stable oxide films [15].…”

“…Nevertheless, the reports about the surface oxidation of solder powders are few and inconsistent [2,15]. Actually, the thickness of oxide films is difficult to control during manufacturing processes.…”

Effect of Oxidation on Indium Solderability

“…A new bonding technique was also reported for a fluxless indium bonding process. [2][3][4] This study focuses on the fluxless solderability of pure indium solder for a chip bonding and fiber attach to chip carrier application. One advantage of pure indium solder is its low melting temperature (156°C).…”