Machining of three-dimensional microstructures in silicon by electro-discharge machining

Reynaerts, Dominiek; Meeusen, Wim; Brussel, Hendrik Van

doi:10.1016/s0924-4247(97)01724-x

Cited by 66 publications

(27 citation statements)

References 6 publications

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“…This process is broadly used for forming very thin rods with high-aspect ratio, which are used as tool electrodes for micro-EDM drilling. Moreover, it also allows shaping complex structures which can be further applied for fabricating 3D structures by using other configurations such as micro-EDM milling [10] and die-sinking. On-machine forming of tool electrodes by an integrated WEDG unit, off-centring problems due to the rotation axis of the spindle can be avoided.…”

Section: Characteristics Of Micro-edmmentioning

confidence: 99%

Process capabilities of Micro-EDM and its applications

Liu

Lauwers

Reynaerts

2009

Int J Adv Manuf Technol

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140

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The Micro Electrical Discharge Machining (Micro-EDM) process has proved to be an appropriate nonconventional machining method for manufacturing accurate and complex three-dimensional structural microfeatures which are difficult to be produced by conventional processes. However, the miniaturisation of the EDM process requests special requirements on the machining equipments. Pulse generators, which can produce small input energy pulses, and high precision systems are the two major criterions. In this paper, newly developed advanced technologies regarding to these aspects are explored with the aid of a commercial micro-EDM machine. First of all, by examining the pulses, innovative strategies implemented in the pulse generator are studied. Indepth research also reveals the correlation between the discharge pulses and the machine parameters in order to provide an indicative overview of process capability. Secondly, precision machining, which is represented by producing a three-dimensional micro-structure such as a micro-compressor, is demonstrated. Accordingly, by examining the machining geometry and surface integrity, process characteristics of micro-EDM are discussed.

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Section: Characteristics Of Micro-edmmentioning

confidence: 99%

Process capabilities of Micro-EDM and its applications

Liu

Lauwers

Reynaerts

2009

Int J Adv Manuf Technol

Self Cite

140

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“…Peng and Liao (2003) and Luo et al (1992) have demonstrated the use of WEDM for slicing silicon wafers using wires in the range of 140-250 lm. Reynaerts et al (1998) have demonstrated the use of fabricating 3D-microstructures using sinker EDM. Heeren et al (1997) successfully fabricated an actuator and sensor using sinker EDM from silicon.…”

Section: L-wedm Of Siliconmentioning

confidence: 99%

Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining

et al. 2009

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This paper reports on the fabrication of high aspect ratio silicon microelectrode arrays by micro-wire electrical discharge machining (l-WEDM). Arrays with 144 electrodes on a 400 lm pitch were machined on 6 and 10 mm thick p-type silicon wafers to a length of 5 and 9 mm, respectively. Machining parameters such as voltage and capacitance were varied for different wire types to maximize the machining rate and to obtain uniform electrodes. Finite element analysis was performed to investigate electrode shapes with reduced lateral rigidity. These compliant geometries were machined using l-WEDM followed by a two step chemical etching process to remove the recast layer and to reduce the cross sections of the electrodes.

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“…Because of this, many micro-parts are not truly three-dimensional; they are considered 2.5D. One research group has successfully produced a truly three-dimensional part in silicon using only the micro-EDM process (Reynaerts 1998). …”

Section: Improving the Accuracy Or Shape Complexity Of Micro-edmed Partsmentioning

confidence: 99%