LT) can be achieved for weakly absorbed photons with energies close to the absorption edge of silicon. [ 15 ] These properties of b-Si are particularly useful for photovoltaic applications.The limiting effi ciency of a solar cell is given by the detailed balance of absorption and radiative recombination [ 16 ] and by nonradiative processes like Auger-and impurity recombination. [17][18][19] b-Si can help to approach those limits in two ways. On the one hand b-Si improves the coupling of light into the solar cell and the absorption of near band edge photons. This in turn increases the short circuit current and on a logarithmic scale also the open circuit voltage. On the other hand, due to excellent light-trapping properties b-Si might also allow reducing the solar cell thickness substantially below 100 µm while sustaining a high light absorption. This reduces nonradiative bulk recombination losses that scale linearly with the solar cell thickness [ 17,18 ] and hence, increases the open-circuit voltage. Of course, reducing the solar cell thickness also increases the cost effi ciency. Decreasing the amount of required silicon feedstock is a major industry concern as can be seen by the growing interest in kerf-free crystalline silicon solar cell technologies. [20][21][22] Unfortunately, besides bulk effects, surface recombination imposes a very critical limit to the solar This article presents an overview of the fabrication methods of black silicon, their resulting morphologies, and a quantitative comparison of their optoelectronic properties. To perform this quantitative comparison, different groups working on black silicon solar cells have cooperated for this study. The optical absorption and the minority carrier lifetime are used as benchmark parameters. The differences in the fabrication processes plasma etching, chemical etching, or laser processing are discussed and compared with numerical models. Guidelines to optimize the relevant physical parameters, such as the correlation length, optimal height of the nanostructures, and the surface defect densities for optoelectronic applications are given.