Digest. International Electron Devices Meeting,
DOI: 10.1109/iedm.2002.1175817
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Mass production worthy HfO/sub 2/-Al/sub 2/O/sub 3/ laminate capacitor technology using Hf liquid precursor for sub-100 nm DRAMs

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Cited by 3 publications
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“…Chrome mask 2 was then applied to pattern the Au thin film on the micropillar by adopting a first lift-off process step. To avoid a very thick insulation film and process complexity, hafnium oxide (HfO 2 ) was used as the insulating layer between the two Au NREs, due to its excellent dielectric properties [40][41][42]. After the first Au layer was patterned on the pillars, a 100 nm HfO 2 layer was coated on the micropillar with a Cambridge Fiji Plasma ALD system (deposition rate, 0.9A/cycle; temperature, 200 • C).…”
Section: Microfabrication Processingmentioning
confidence: 99%
“…Chrome mask 2 was then applied to pattern the Au thin film on the micropillar by adopting a first lift-off process step. To avoid a very thick insulation film and process complexity, hafnium oxide (HfO 2 ) was used as the insulating layer between the two Au NREs, due to its excellent dielectric properties [40][41][42]. After the first Au layer was patterned on the pillars, a 100 nm HfO 2 layer was coated on the micropillar with a Cambridge Fiji Plasma ALD system (deposition rate, 0.9A/cycle; temperature, 200 • C).…”
Section: Microfabrication Processingmentioning
confidence: 99%
“…Recently, the atomic layer deposition (ALD) is used when the high step coverage (13)(14)(15)(16) and high quality film formation at the low deposition temperature is required. However, the deposition rate of the current ALD is relatively low compared to the chemical vapor deposition (CVD), which can form the SiNx with relatively high deposition rate.…”
Section: Introductionmentioning
confidence: 99%