A fourth-order, three-stage, feedforward cascade sigma-delta modulator (ƩΔM) for CMOS image sensor applications is realized in low leakage, high threshold voltage 65 nm CMOS standard process. A top down CAD methodology is used for the design of building blocks, which involves statistical and simulation optimization at different stages of modulator. The multi-bit ƩΔ architecture employs OTA sharing technique with the dual integrating scheme at the first stage and the gain boosted pseudo-differential class-C inverters as OTAs for the rest two stages for low area and power consumption. The operation of proposed ƩΔM is validated through post-layout simulations, considering worst case. The ƩΔM operates at a power supply of 1-V offering a peak signal-to-ratio of 92 dB and a peak signal-to-noise plus distortion ratio of 89 dB for a signal bandwidth of 100 kHz. The overall power and estimated area consumed by the ƩΔM including auxiliary blocks is 159 µW and 101.2 mm 2 , respectively.