MCM-LD: large area processing using photosensitive-BCB

Strandjord, Andrew; Garrou, Philip E.; Heistand, R.; Tessier, T.G.

doi:10.1109/96.386260

Cited by 9 publications

(4 citation statements)

References 23 publications

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“…Additionally, polymers that are typically used in device manufacturing, in general, also need to be subjected to another high-temperature processing step, typically called the final cure, for a lengthy period of time in order to achieve the desired polymer material characteristics, which include good mechanical, chemical, and electrical characteristics. [27][28][29] All of these processing steps can affect the planarity of the polymer on top of the topographic surface.…”

Section: Planarization Performance Of Cyclotene On Si Topographymentioning

confidence: 99%

“…For instance, a temperature of at least 250°C is typically needed to reflow and fully cure cyclotene and which process time could take up to 4 h, depending on the curing methods used. [27][28][29] This reflow and curing process of cyclotene can also be performed at 300°C or higher temperature in a much shorter time. However, a short thermal reflow process time typically result in poor planarization.…”

Section: Planarization Performance Of Cyclotene On Si Topographymentioning

confidence: 99%

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CON-TACT Planarization Process of Spin-on Dielectrics for Device Fabrication

Shih

Yota

Itchhaporia

2008

J. Electrochem. Soc.

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Planarization has become a necessity for fabricating devices, large and small. Without planarization, only a limited number of layers of interconnects or device structures can be successfully fabricated. CON-TACT planarization is a method that applies and extends the fundamentals of press planarization by utilizing external force to bring an optically flat surface in physical contact with flowable materials. The surface planarity is replicated from that of the optically flat surface to the planarized flowable material surface, which is then hardened and separated afterward from the pressing surface to achieve planarity. In this study, CON-TACT planarization technology has been utilized to planarize various polymer dielectric materials coated on both Si and GaAs topography and device wafers, resulting in both local and global planarity. The polymer materials used in this study include cyclotene, polybenzoxazole, and polyimide. The results show that a topography or step height reduction of up to 98% was achieved. Additionally, the overburden variation from die to die was also significantly reduced with this method. This performance promises great potential for CON-TACT planarization technology to provide more consistent, more reliable, and improved device performance for more sophisticated and complex device designs with higher yield.

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Section: Planarization Performance Of Cyclotene On Si Topographymentioning

confidence: 99%

Section: Planarization Performance Of Cyclotene On Si Topographymentioning

confidence: 99%

CON-TACT Planarization Process of Spin-on Dielectrics for Device Fabrication

Shih

Yota

Itchhaporia

2008

J. Electrochem. Soc.

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“…It is important to emphasize that 100% cure of the waveguide polymer is not always desirable in sequential processing, since adhesion of the core polymer to the subsequent cladding polymer layers will deteriorate with a higher DOC. 13…”

Section: Cure Kinetics Experimentsmentioning

confidence: 99%

“…The reason for slow progress of cure at higher DOC is because of the diffusion‐controlled nature of the cure reactions. It is important to emphasize that 100% cure of the waveguide polymer is not always desirable in sequential processing, since adhesion of the core polymer to the subsequent cladding polymer layers will deteriorate with a higher DOC 13…”

Section: Cure Kinetics Experimentsmentioning

confidence: 99%

Optical loss changes in siloxane polymer waveguides during thermal curing

Hegde

Liu

Chang

et al. 2007

J of Applied Polymer Sci

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ABSTRACT:The optical loss change in siloxane polymer waveguides during isothermal curing conditions is studied for the wavelengths of 850 and 1310 nm. As a first step, the evolution of degree-of-cure is determined from differential scanning calorimetry and compared to optical absorption from spectroscopy. It is found that the optical loss due to absorption mechanisms is related to the extent of cure reactions in the polymer. Optical loss due to scattering mechanisms is related to local density fluctuations, and is studied using dielectric analysis. Optical loss measurements are conducted on both uncladded and cladded waveguides during isothermal cure, which results in certain optical loss trends. Based on the trends, the underlying mechanisms for the optical loss variations are proposed and a cure schedule to realize the lowest optical loss is suggested.

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