Measurement and Simulation of Stacked Die Thermal Resistances

Steady-state electro-thermal analysis and optimization of multilayer boards and substrate-integrated waveguide filters

“…But it is a bit too complex to handle multiple or distributed heat sources, besides its inability to obtain the temperature distribution of whole structure. In , the entire heat dissipation path is treated as one or several thermal resistors. However, this method has similar shortcomings as CTM, especially for complex structures and applications, such as SoPs.…”

Thermal Measurement and Modeling of Multi-Die Packages

“…A recent tendency is to measure the temperature change on all chips in the package and to report the results of all these measurements. In what format and with what content this reporting should be done, is still open to discussion [9], but measuring and reporting a full thermal resistance matrix [7], [8] or thermal impedance matrix [6], [10] seems to gain wider acceptance among different thermal research teams. The attempts to create thermal models out of measurement results include resistor networks with a few elements only [5], [7] or providing the network representation of the complete thermal resistance matrix [8] or providing all the elements of the thermal impedance matrix by means of time-domain or frequency-domain functions [6], [10] or even by means of a dynamic compact model derived from structure functions [10].…”