No abstract

The junction-to-board thermal resistance, e J B or Theta JB, is a figure of merit for the thermal performance of surface mount integrated circuit packages relative to the printed circuit board temperature. The determination of e J B by measurement or simulation is described. Examples of the use of e J B in thermal modeling are provided along with estimates of anticipated accuracy. This model provides substantial accuracy improvements over estimates of thermal performance based on junction to ambient thermal resistance.

No abstract

No abstract

No abstract