2003
DOI: 10.1016/s0749-6419(02)00040-2
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Measurement of deformation fields in polycrystalline OFHC copper

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Cited by 69 publications
(37 citation statements)
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“…According to (10) and (11), the elastic modulus along <110> and <111> orientations is E 110 � 193.81 GPa and E 111 � 299.77 GPa, respectively. e highest elastic stiffness is along the <111> orientation, and the lowest stiffness is along the <100> orientation, as shown in In order to deeply understand the GB characterization, three types of incompatibility bicrystal models were built by combining grains with different orientations mentioned above, as listed in Table 2.…”
Section: Materials Proprietymentioning
confidence: 99%
See 1 more Smart Citation
“…According to (10) and (11), the elastic modulus along <110> and <111> orientations is E 110 � 193.81 GPa and E 111 � 299.77 GPa, respectively. e highest elastic stiffness is along the <111> orientation, and the lowest stiffness is along the <100> orientation, as shown in In order to deeply understand the GB characterization, three types of incompatibility bicrystal models were built by combining grains with different orientations mentioned above, as listed in Table 2.…”
Section: Materials Proprietymentioning
confidence: 99%
“…Many attempts have been made to acquire the stress state of the crack tip due to its importance [6,7]; however, the stress and strain are obtained macroscopically based on the assumption that the materials are isotropic and homogeneous in terms of elastic deformation when the materials have random crystallographic and morphologic texture. In fact, the crack tip stress state is significantly affected by the microstructure of materials due to the misorientation and anisotropic of each component crystal, and the crack tip would have a nonuniform stress at the microstructural level even under a uniform remote stress condition [8][9][10][11]. e inhomogeneity stress distribution caused by anisotropic of grains would play an important role in the initiation and propagation of SCC [12].…”
Section: Introductionmentioning
confidence: 99%
“…Several lithographic processes exist and allow to obtain micrometric gratings [Dally and Read, 1993, Xie et al, 2003, Allais et al, 1994, Schroeter and McDowell, 2003]. Direct interferometric photolithography was selected here.…”
Section: Full-field Measurementmentioning
confidence: 99%
“…3 Frequencies of step angle in 4-and 35-dpa-irradiated and 2% deformed stainless steel samples 6) elastic property of each crystal. [9][10][11][12][13][14] Figure 6 shows the stress distribution along a line parallel to the z-axis. Here, the stresses were obtained by interpolating adjacent integral points of solid elements.…”
Section: Finite Element Analysismentioning
confidence: 99%
“…The anisotropic properties of each crystal produce nonuniform stress at the microstructural level. [9][10][11][12][13][14] This may affect the angular distribution of step angle.…”
Section: Introductionmentioning
confidence: 99%