Measurement of joint resistance of Bi-2223/Ag tapes using one-turn shorted coil

Tanaka, Kenichi; Ninomiya, A.; Ishigohka, T.; Kurahashi, Kiyoshi

doi:10.1109/77.919694

Cited by 9 publications

(4 citation statements)

References 2 publications

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“…Previous work on resistive joints between superconducting tapes has been aimed at reducing the joint resistance of the jointed tapes [1][2][3][4][5][6][7]. Of particular relevance are the works of T. Fukuzaki et al [6], a joint resistance of 1.27 × 10 −12 was obtained in Superconducting Joint.…”

Section: Introductionmentioning

confidence: 95%

“…The conventional method adopted in engineering practice is to join Z. Yan ( ) · H. Li · H. Shao · R. Wu · Y. Wang School of Electrical Engineering, Southwest Jiaotong University, Chengdu, Sichuan 610031, P.R. China e-mail: yzm@home.swjtu.edu.cn superconducting tapes by the resistive-joint method [1][2][3][4][5][6][7][8]. A crucial problem for the superconducting magnet operation in the persistent current mode is to make a joint with extremely low resistance between superconducting multifilamentary wires, whose resistance is an important parameter to evaluate the superconducting magnet performance.…”

Section: Introductionmentioning

confidence: 99%

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Experimental Investigations on the Critical Current of the Jointed Bi-2223/Ag HTS Tapes

Yan

Shao

et al. 2012

J Supercond Nov Magn

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This paper summarizes the experimental investigations on the critical current of two jointed Bi-2223/Ag superconducting tapes connected by Sn63Ag2Pb solder. Different lap lengths of contact surface were studied. The joint resistance was measured to be in the range of 0.059 ∼ 0.76 µ , and the critical current of the jointed Bi-2223/Ag HTS tapes was measured with different charging rates using standard four-point-method in a zero-applied magnetic field applying 1 µV/cm criterion. The experimental results showed that the longer the lap length was, the smaller the joint resistance was and the nearer the critical current approached that of Bi-2223/Ag superconducting short-sample. On the other hand, the critical current decreased with the increasing of the charging rate.

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Section: Introductionmentioning

confidence: 95%

Section: Introductionmentioning

confidence: 99%

Experimental Investigations on the Critical Current of the Jointed Bi-2223/Ag HTS Tapes

Yan

Shao

et al. 2012

J Supercond Nov Magn

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“…With the addition of Ag to Bi-based alloys, the ductility of the brittle Bi phase could be drastically improved. Meanwhile, Bi-Ag alloys exhibited a non-equilibrium solidi cation feature and have a considerably large undercooling compared with pure Bi 13,15) . It has been well documented that the addition of Ag to Bi would slightly improve the thermal and electrical conductivities of the alloy 16) .…”

Section: Introductionmentioning

confidence: 99%

“…Thus, they have been developed in die attach solder for power devices and light-emitting diodes (LEDs) [12][13][14] . With the addition of Ag to Bi-based alloys, the ductility of the brittle Bi phase could be drastically improved.…”

Section: Introductionmentioning

confidence: 99%

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

et al. 2016

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Tensile properties of three Bi-based lead-free solder which are pure Bi, Bi-1.0Ag-0.3Sn-0.03Ge (mass%), and Bi-2.5Ag (mass%) were investigated and compared with that of Pb-rich Pb-2.5Ag-2.5Sn (mass%) solder. Tensile strength of pure Bi is the minimum among solder investigated regardless of the temperature and strain state. Although tensile strength of Bi-based solder is lower than that of Pb-2.5Ag-2.5Sn at 25 C, those of Bi-1.0Ag-0.3Sn-0.03Ge and Bi-2.5Ag improve and become analogous and higher than that of Pb-2.5Ag-2.5Sn at a temperature of 125 C or more. The effect of strain rate on elongation is negligible in solder investigated. Although elongations of Bi-based lead-free solder are lower than that of Pb-2.5Ag-2.5Sn at 25 C, they increase with increasing temperature. While the elongation of Pb-2.5Ag-2.5Sn relatively stable at approximately 20-30% regardless of temperature, elongations of Bi-1.0Ag-0.3Sn-0.03Ge and Bi-2.5Ag become a same level with that of Pb-2.5Ag-2.5Sn at 125 C and 175 C. In particular, the ductility of pure Bi which is about 5% improves drastically at temperatures of 75 C or more and the elongation rises to approximately 60%. From microstructure observation results, it was con rmed that the addition of small amount of Sn and Ge is effective to form ne microstructure. From fracture surface observation results, it was con rmed that brittle fracture occurs at 25 C and the fracture mode changes to ductile fracture when the temperature increases and the ductility improves.

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Effect of Sb addition on Bi–2.6Ag–0.1Cu solders for high-temperature applications

Kim

Lee

et al. 2014

Journal of Alloys and Compounds

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Measurement of joint resistance of Bi-2223/Ag tapes using one-turn shorted coil

Cited by 9 publications

References 2 publications

Experimental Investigations on the Critical Current of the Jointed Bi-2223/Ag HTS Tapes

Experimental Investigations on the Critical Current of the Jointed Bi-2223/Ag HTS Tapes

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

Effect of Sb addition on Bi–2.6Ag–0.1Cu solders for high-temperature applications

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