In this paper, some of the recent achievements in surface-activation-based nanobonding technology are described. This bonding technology allows for the combination of electronic, photonic, fluidic and mechanical functionalities into small form-factor systems for emerging applications in health diagnostics and screening, for example. These nanobonding technologies provide void-free, strong, and nanoscale bonding at room temperature or at low temperatures (<200 °C), and they do not require chemicals, adhesives, or high external pressure. The interfaces of the nanobonded materials in ultra-high vacuum and in air correspond to the covalent bonds, and hydrogen and hydroxyl bonds, respectively, which gives rise to excellent bonding properties. Further, these nanobonding technologies are well-suited for the development of low-cost, high-performance miniaturized systems such as biophotonic imaging systems.Keywords: Surface activated nanobonding, surface, interface, metal interconnects, semiconductor fabrication, bonding in ultra-high vacuum and in air, biophotonic imaging systems.