Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics

“…Although the alloy solder can join different materials with ultrahigh bonding strength, they usually need high heating temperatures. [30][31][32][33][34][35][36] On the contrary, the transient liquid phase (TLP) technology which utilizes the principle of eutectic bonding can be operated at low temperatures. Metal layers that can satisfy the eutectic conditions are usually used for the realization of eutectic bonding.…”

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

“…The practical use of SnZn solders is limited because the existence of Zn-rich phase greatly reduces the oxidation resistance of the SnZn solder [93]. Under high temperature and humidity conditions, water vapor and oxygen oxidized both the surface microstructure and Zn-rich phase in the solder matrix, resulting in volume expansion and the increase of internal stress, which easily induces cracks along Sn grain boundaries.…”

“…The current research mainly focuses on the effect of thermal stress and current stress on the performance of the solders. However, more and more electronic devices are applied to harsh environments such as cryogenic temperatures [93,94] and irradiation [95]. Therefore, research on the reliability of the solder bearing nanoparticles in these harsh environments will become a hot spot in this subject.…”

The Influence of Cryogenic Conditions on the Process of AA2519 Aluminum Alloy Cracking

“…An example of using the cryogenic chamber to determine mechanical properties of materials at the cryogenic temperature of joints is the one in the article [22]. Graphene [23] and alloy steels [24] and austenitic steels [25] are also tested under cryogenic conditions.…”