Mechanical Properties of the Interface between Nickel Contact and Extruded (Bi1-xSbx)2(Te1-ySey)3 Thermoelectric Materials

Vasilevskiy, D.; Roy, F.; Renaud, E.; Masut, R. A.; Turenne, S.

doi:10.1109/ict.2006.331229

Cited by 3 publications

(3 citation statements)

References 9 publications

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“…Since the Sn in image (b) and Te in image (d) are distributed in almost the same location at the bonding interface, it is reasonable to assume Sn diffuses mutually with Te in the thermoelectric elements to form intermetallic compounds. The Sn-Te intermetallic compounds are known to show brittleness [8][9], and it is expected that cracking will propagate from the Sn-Te intermetallic compounds to fracture the thermoelectric materials.…”

Section: Resultsmentioning

confidence: 99%

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Archives of Metallurgy and Materials

Bae¹,

Han²,

Son³

et al. 2019

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In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoelectric elements without electroless Pd-P plating, and the fracture of the bond originated from these intermetallic compounds. A Pd-Sn solder reaction layer with a thickness of approximately 20 μm was formed under the Pd-P plating layer in the case of the electroless Pd-P plating, and prevented the diffusion of Bi and Te. In addition, the fracture did not occur on the bonding interface but in the thermoelectric elements for the electroless Pd-P plating because the bonding strength of the Pd-Sn reaction layer was higher than the shear strength of the thermoelectric elements.

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Section: Resultsmentioning

confidence: 99%

“…A Ni layer is commonly used as a diffusion barrier layer for suppressing the formation of Sn-Te intermetallic compounds [8][9]. Electroplating, electroless plating, physical vapor deposition (PVD), and the spraying method have been suggested as effective methods for forming this Ni layer.…”

Section: Introductionmentioning

confidence: 99%

Archives of Metallurgy and Materials

Bae¹,

Han²,

Son³

et al. 2019

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“…For bonding of thermoelectric elements and the copper electrode, soldering is most commonly adopted, in which Sn alloys with low melting points are melted and added [6,7]. However, Sn, which is the major component of solder, and Te, a component of the thermoelectric elements, are known to form thick intermetallic compounds at approximately 520 K. This Sn-Tebased metallic compounds not only decrease the efficiency of the thermoelectric module but also decrease the strength of the thermoelectric module bonding due to its high brittleness [8,9].…”

Section: Introductionmentioning

confidence: 99%

Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules

Kim

Son

Kim

2017

Archives of Metallurgy and Materials

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In the present study, electroless Ni-P plating was applied to Bi-Te-based thermoelectric materials as a barrier layer and the effect of the Ni-P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n-and p-type modules increased after being subjected to the electroless Ni-P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni-P plating, Sn and Te were interdiffused and formed a brittle Sn-Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi-Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.

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