Abstract. Investigation of hermetic sealing of selected polymers in silicon-glass microcavities has been presented. The anodic bonding method has been adapted for hermetic encapsulation of the polymer in microcavity. According to standard conditions of the anodic bonding process (temperature: 400°C, voltage: 1000 V), the main challenge was the significant reduction of temperature in order to avoid degradation of the polymer. An analysis of the influence of reduced temperature and oxygen-free atmosphere on bond quality has been done. Proper parameters of the anodic bonding process enabling good and hermetic encapsulation of the polymer in the microcavity as well as optimal polymer treatment have been elaborated. Studies have shown that the closure of high density polyethylene in microcavity by anodic bonding process at a temperature reduced to 340°C is possible. This procedure will be used for the fabrication of main elements for a new family of high radiation MEMS sensors.Key words: anodic bonding, polymer filling, sealing of silicon and glass.Sealing of silicon-glass microcavities with polymer filling P. KNAPKIEWICZ* and I. AUGUSTYNIAK Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, 11/17 Janiszewskiego St., 50-372 Wrocław, Poland in presence of polymer, reduced temperature and oxygen-free atmosphere is necessary and is the main subject of this article. The technology developed and described here opens the way to fabricate MEMS sensors of high level of radiation. The development of high radiation MEMS sensor, including sensor technology and radiation tests, is presented in [21].
Technical analysis2.1. Anodic bonding process. The direct silicon-to-glass anodic bonding is a direct sealing process in which a stable chemical bond between bonded materials is obtained. The anodic bonding process is a complicated chemical reaction, which has been shown in three main steps (Fig. 1) [22]:• generation of electrostatic force by applied voltage -initiation of joining substrates, • formation of depleted layer in glass by sodium ion current, • formation of Si-O chemical bond.