Mems manufacturing testing: an accelerometer case study

Maudie, Theresa; Hardt, A.; Nielsen, Richard J.; Stanerson, D.; Bleschke, R.; Miller, M.

doi:10.1109/test.2003.1271069

Cited by 13 publications

(6 citation statements)

References 4 publications

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“…This section discusses the limitation and issues of test systems reported in literature. An attempt was made by Maudie et al [124] to improve ATE (Automated Test Equipment) for testing accelerometers in parallel. Variations in electrical parameters occurred from device to device in case of producing MEMS devices in bulk.…”

Section: Issues In Parallel Testingmentioning

confidence: 99%

A Review on Key Issues and Challenges in Devices Level MEMS Testing

et al. 2016

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The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market.

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Section: Issues In Parallel Testingmentioning

confidence: 99%

A Review on Key Issues and Challenges in Devices Level MEMS Testing

et al. 2016

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“…SPEA has recently introduced an ATE system compatible with a wide range of sensors such as inertial sensors, gas and biochemical sensors, magnetic speed sensors, and Ultraviolet (UV) sensors. The ULTRA P is a high-performance production MEMS testing handler that provides thermal conditioning, full 6 degrees of freedom (DOF) mechanical stimulus, and an electrical ATE signal path for testing MEMS Accelerometers and Gyroscopes made by Focus Test [43]. This device can do up to 96 DUT at the same time and apply mechanical and thermal stimuli to sensors [43].…”

Section: Introductionmentioning

confidence: 99%

A New Non-Invasive Air-Based Actuator for Characterizing and Testing MEMS Devices

2020

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This research explores a new ATE (Automatic Testing Equipment) method for Micro Electro Mechanical Systems (MEMS) devices. In this method, microscale aerodynamic drag force is generated on a movable part of a MEMS sensor from a micronozzle hole located a specific distance above the chip that will result in a measurable change in output. This approach has the potential to be generalized for the characterization of every MEMS device in mass production lines to test the functionality of devices rapidly and characterize important mechanical properties. The most important testing properties include the simultaneous application of controllable and non-invasive manipulative force, a single handler for multi-sensor, and non-contact characterization, which are relatively difficult to find with other contemporary approaches. Here we propose a custom-made sensing platform consisting of a microcantilever array interconnected to a data acquisition device to read the capacitive effects of each cantilever’s deflection caused by air drag force. This platform allows us to empirically prove the functionality and applicability of the proposed characterization method using airflow force stimuli. The results, stimulatingly, exhibited that air force from a hole of 5 µm radii located 25 µm above a 200 × 200 µm2 surface could be focused on a circular spot with radii of approximately 5 µm with surface sweep accuracy of <8 µm. This micro-size airflow jet can be specifically designed to apply airflow force on the MEMS movable component surface. Furthermore, it was shown that the generated air force range could be controlled from 20 nN to 60 nN, approximately, with a linear dependency on airflow ranging from 5 m/s to 20 m/s, which is from a 5 µm radius microhole air jet placed 400 µm above the chip. In this case-study chip, for a microcantilever with a length of 400 µm, the capacitance curve increased linearly from 28.2 pF to 30.5 pF with airflow variation from 5 m/s to 21 m/s from a hole. The resultant curve is representative of a standard curve for testing of the further similar die. Based on these results, this paper paves the way towards the development of a new non-contact, non-invasive, easy-to-operate, reliable, and relatively cheap air-based method for characterizing and testing MEMS sensors.

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“…1,2 Physical characteristics of MEMS refer to several specific physical characteristics, such as elasticity coefficient, residual stress, stress gradient, intensity and strength fatigue. 3 These parameters are indispensable in the design process of MEMS devices.…”

Section: Introductionmentioning

confidence: 99%

A method for measuring bending stresses based on electromagnetic actuation and Raman spectroscopy

Ren

Chen

et al. 2006

J Raman Spectroscopy

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Bending stress and fracture strength of micromachined structures are the parameters determining the function and life span of microelectromechanical systems (MEMS) and are also indispensable data for MEMS design. This paper reports the results of a study in which a bending stress measurement method based on electromagnetic actuation and Raman spectroscopy has been examined. In this study, an eightcantilever mass structure is chosen as the experimental object. The results have indicated that it can accurately measure the bending stresses and fracture strength.

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Mems manufacturing testing: an accelerometer case study

Cited by 13 publications

References 4 publications

A Review on Key Issues and Challenges in Devices Level MEMS Testing

A Review on Key Issues and Challenges in Devices Level MEMS Testing

A New Non-Invasive Air-Based Actuator for Characterizing and Testing MEMS Devices

A method for measuring bending stresses based on electromagnetic actuation and Raman spectroscopy

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