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Electrical testing of MicroElectroMechanical Systems(MEMS) can take on many different forms including wafer probing, electrical trimming, final test at temperatures, engineering characterization, and reliability evaluations. MEMS testing has had limited visibility in literature from companies that have successfully industrialized applications such as pressure sensors and accelerometers. This limited visibility is not an indication of the importance of this topic that represents a significant portion of the overall cost, rather it is more likely and indication custom nature of test for MEMS. This paper presents a case study that addresses the issues associated with MEMS testing of accelerometer devices and an effective solution based on a system approach.

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Pressure sensors serve a variety of automotive applications, some which may experience high levels of acceleration such as tire pressure monitoring. To design pressure sensors for high acceleration environments it is important to understand their sensitivity to acceleration especially if thick encapsulation layers are used to isolate the device from the hostile environment in which they reside. This paper describes a modeling approach to determine their sensitivity to acceleration that is very general and is applicable to different device designs and configurations. It also describes the results of device testing of a capacitive surface micromachined pressure sensor at constant acceleration levels from 500 to 2000 g's.