Metal-Metal Bonding Process Using Ag₂O/CuO Mixed Particles

Abstract

The present study describes metal-metal bonding process using mixture of CuO nanoparticles and Ag2O nanoparticles (Ag2O/CuO mixed particles). The leaf-like aggregates with a longitudinal size of 1116 nm and a lateral size of 460 nm composed of CuO nanoparticles with a size of ca. 10 nm and the Ag2O nanoparticles with a size of 20.6 nm were fabricated with a salt-base reaction. Metal-metal bonding could be successfully performed by using the mixed particles as a filler sandwiched between metallic discs and pressurizing the discs at 1.2 MPa for 5 min under annealing in H2 gas at 400oC. The mixed particles bonded not only metallic Cu discs but also metallic Ag discs strongly; The shear strengths were as large as 17.3 and 22.4 MPa for the Cu discs and the Ag discs, respectively.

Synthesis of silver/copper nanoparticles and their metalmetal bonding property

“…In our previous work [17], mixture of copper oxide nanoparticles and silver oxide nanoparticles was examined for bonding of not only metallic copper but also metallic silver. Though this bonding process worked well, the mixture had to be fabricated with many steps composed of synthesis of copper oxide nanoparticles, synthesis of silver oxide nanoparticles, and homogeneously-mixing of those nanoparticles.…”