2003
DOI: 10.1007/s11664-003-0048-8
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Metal-organic vapor-phase epitaxial growth of HgCdTe device heterostructures on three-inch-diameter substrates

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Cited by 39 publications
(15 citation statements)
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“…Selex ES has over 14 years' experience in the MOVPE growth of MCT by the interdiffused multilayer process (IMP) on GaAs substrates [1]. MOVPE allows control of the alloy composition (x) across the entire compositional range between CdTe and HgTe without any changes to the reactor growth conditions, allowing heterostructure and bandgap engineering approaches to achieve innovative device designs, such as the separation of the gain and absorption regions in APDs used in adaptive optics applications, achieving high breakdown voltage while maintaining high gain [2].…”
Section: Advantages Of Movpementioning
confidence: 99%
“…Selex ES has over 14 years' experience in the MOVPE growth of MCT by the interdiffused multilayer process (IMP) on GaAs substrates [1]. MOVPE allows control of the alloy composition (x) across the entire compositional range between CdTe and HgTe without any changes to the reactor growth conditions, allowing heterostructure and bandgap engineering approaches to achieve innovative device designs, such as the separation of the gain and absorption regions in APDs used in adaptive optics applications, achieving high breakdown voltage while maintaining high gain [2].…”
Section: Advantages Of Movpementioning
confidence: 99%
“…The growth, delineation and hybridisation technologies are very mature and have been reported in several previous papers [3][4][5][6][7][8][9][10]. FPAs exploiting this technology have been in volume production for many years with 16µm pixels and larger.…”
Section: Movpe-grown Materials and Mesa Diodesmentioning
confidence: 99%
“…Much of the initial work on the reactor was carried out on 3-inch diameter GaAs wafers and the heterostructures were aimed at achieving increased operating temperature devices [5][6][7] so that the issue of thermal expansion differences between the Si ROIC and the IRFPA were negated. However, when cooled operation is required, a back-thinning approach similar to that employed in indium antimonide (InSb) device technologies can be used to overcome the expansion coefficient problems.…”
Section: Growth On Gaasmentioning
confidence: 99%