Metallization by plating for high-performance multichip modules

Wong, K.K.; Kaja, S.; DeHaven, Patrick W.

doi:10.1147/rd.425.0587

Cited by 27 publications

(17 citation statements)

References 16 publications

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“…The pursuit of smaller and faster semiconductor devices along with the packaging complexity of integrated circuitry inevitably led to a transition from aluminum-based to copper wiring [78][79][80]. The main advantages of copper-low resistance, high electromigration resistance, and good scalability-were explored extensively and contributed to this major technology transition [79,[81][82][83].…”

Section: Introductionmentioning

confidence: 99%

“…However, integrating copper in the manufacturing process presented an enormous research and technology development challenge [79]. Development the of dual-damascene processing approach by the IBM research team integrated copper electrodeposition as a manufacturing method and marked a major breakthrough in the semiconductor industry [4,77,79,80].…”

Section: Introductionmentioning

confidence: 99%

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Applications to Magnetic Recording and Microelectronic Technologies

Brankovic¹,

Vasiljević²,

Dimitrov³

2010

Modern Electroplating

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Early applications of electrodeposition in manufacturing were mainly confined to situations where relatively thick polycrystalline metal deposits were needed. These included protective or sacrificial metal layers for corrosion protection, decorative applications, and situations where metal coatings with specific mechanical properties were needed [1]. However, development of theoretical foundations in electrochemical engineering and electrometallurgy and the sophistication of the tools used for electrodeposition have contributed to widespread electrodeposition in high-tech industry where more rigorous thickness control of the deposit is required. Nowadays, electrodeposition is recognized as a mature deposition method for the fabrication of magnetic thin-film heads [2, 3] and in microelectronics and microelectromechanical system (MEMS) technologies [4][5][6][7]. The most recent developments suggest that electrodeposition is an attractive fabrication process for many emerging fields of nanotechnology. These new applications make the future of electrodeposition research a seemingly interesting and quite exciting endeavor.In this chapter we will review the most important electrodeposition processes used for fabrication of magnetic recording heads and in microelectronics technology. The most important parameters, criteria, and phenomena controlling the deposit morphology and properties are highlighted and discussed using the examples from the authors' own work and from the work of other prominent groups around the world. MAGNETIC RECORDINGNowadays electrodeposition is used for the fabrication of many important parts of magnetic recording heads, including magnetic shields and poles, Cu coils, and for connecting Cu studs, leads and pads, Au interconnects, and nonmagnetic gaps and coatings. Some of these electrodeposition processes and bath chemistries were adopted from other technologies as a common practice. However, the fabrication of the writing pole in magnetic recording heads has been the most important manufacturing step where electrodeposition has gained its fame as a cost-effective, reliable, and high-throughput operation (Fig. 27.1a). Over the years, the development of magnetic reader technologies, recording medias and the geometry of the magnetic recording process have posed many challenges that electrodeposition had to meet in order to stay competitive with other deposition methods. The common requirement for the alloys for magnetic pole fabrication is that they have low coercivity (softness), low magnetostriction (l % 0), and relatively high magnetic moment. The electrodeposition process of these alloys has to be scalable with high-throughput manufacturing with minimum effort in process control and reproducibility. The bath chemistry has to be stable over the time and compatible with other materials and processes used in through-mask fabrication.In the very beginning, the electrodeposited magnetic alloy for magnetic pole application was Ni 81 Fe 19 -Permalloy (inductive read heads)-with saturation magnetic fl...

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Applications to Magnetic Recording and Microelectronic Technologies

Brankovic¹,

Vasiljević²,

Dimitrov³

2010

Modern Electroplating

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“…However, the requirement of Cu metallization for other applications such as Cu base of solder bump and gate electrodes of thin film transistors (TFTs) focuses on the control of pattern shape rather than the filling capability as required for trenches for ULSI circuits [4,5]. Besides, owing to the much larger feature size in TFTs or solder bump than that of ULSI circuits, electrodeposition through mask other than panel deposition could be used in these applications [6]. Electrodeposition through mask is an additive method which selectively deposits Cu on the desired area.…”

Section: Introductionmentioning

confidence: 99%

The influence of self-assembled disulfide additive on the pattern shape by Cu electrodeposition through mask

Jenq

Wan

Wang

2007

Journal of Electroanalytical Chemistry

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“…In either case, pattern electroplating or electroforming with a photoresist mask is an effective method of bump fabrication. Electroplating is an established technique in board manufacturing, and copper electroplating has been widely used for through-hole plating in conventional printed wiring boards (PWBs) and for filling microvias in high-density boards [3], [4]. In principle, therefore, it should be relatively straightforward for board manufacturers to adopt pattern electroplating for bump formation, although in practice there are technical challenges.…”

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confidence: 99%

Thermosonic Flip Chip Interconnection Using Electroplated Copper Column Arrays

Gao

Holmes

2006

IEEE Trans. Adv. Packag.

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Abstract-A novel flip chip process is reported in which bare dies are thermosonically bonded to arrays of electroplated copper columns formed on a substrate. The new process is intended as a low-cost, lead-free chip-on-board (COB) interconnection method for high-frequency devices. A detailed study has been performed of the electroplating and thermosonic bonding techniques involved. It was found that oxygen plasma treatment of the resist mask could increase the yield of the fine-pitch ( 150 m) column electroplating process, while the flatness of the resulting columns was affected by the plating current density and the sidewall profiles in the resist mold. Under optimal conditions, column arrays with flat tops could be produced with a 100% yield, and with a column height deviation of less than 0.5 m over an area of 10 mm 10 mm. The array thermosonic bonding process was studied with the aid of Box-Behnken design of experiments based on response surface methodology. A second-order relationship between the input bonding variables and the bonding strength was derived and used to determine optimal process conditions. With this optimized process, silicon chips with aluminium metallization were thermosonically flip chip bonded to quartz test boards bumped with gold-capped copper columns. Sixteen prototype assemblies without underfill protection were evaluated by accelerated lifetime tests. The contact resistances of single column connections showed no significant change after 50 thermal shocks of 0 C to 100 C, and samples subjected to high-temperature storage remained intact at all bonding interfaces after 1.5 h at 300 C. Thermal cycling between 55 C and 125 C produced open-circuit defects in a small number of connections after 70 cycles.Index Terms-Chip-on-board, copper column, design of experiments, electroplating, flip chip, lead-free, oxygen plasma treatment, response surface methodology, thermosonic (TS) bonding.

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Metallization by plating for high-performance multichip modules

Cited by 27 publications

References 16 publications

Applications to Magnetic Recording and Microelectronic Technologies

Applications to Magnetic Recording and Microelectronic Technologies

The influence of self-assembled disulfide additive on the pattern shape by Cu electrodeposition through mask

Thermosonic Flip Chip Interconnection Using Electroplated Copper Column Arrays

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