2018
DOI: 10.1109/jestpe.2017.2721429
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Methodology for Characterization of Common-Mode Conducted Electromagnetic Emissions in Wide-Bandgap Converters for Ungrounded Shipboard Applications

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Cited by 58 publications
(15 citation statements)
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“…Thus, GaN devices are limited to low-voltage applications (<650 V) while SiC devices are preferred for high-voltage operations [2]. WBG devices have already been successfully used on several power electronics applications, such as: wireless chargers [5], [6], onboard EV chargers [7], [8], energy storage systems [9], shipboard electrification [10], and AC electric drives [11]. Furthermore, two-level SiC converters such as voltage source converters (Fig.…”
Section: Introductionmentioning
confidence: 99%
“…Thus, GaN devices are limited to low-voltage applications (<650 V) while SiC devices are preferred for high-voltage operations [2]. WBG devices have already been successfully used on several power electronics applications, such as: wireless chargers [5], [6], onboard EV chargers [7], [8], energy storage systems [9], shipboard electrification [10], and AC electric drives [11]. Furthermore, two-level SiC converters such as voltage source converters (Fig.…”
Section: Introductionmentioning
confidence: 99%
“…By application of silicon carbide (SiC) devices, the system power density can be further improved through the reduction in size of cooling systems or passive components [2,5,6]. With low loss, fast switching speed, and high temperature withstanding capabilities, SiC devices are considered to be the key driving force for high performance and high power density converters in automotive, aerospace and industrial applications [2,3,[6][7][8][9].…”
Section: Introductionmentioning
confidence: 99%
“…However, many of the performance advantages of SiC devices are attributed to their increased switching speeds (di/dt, dv/dt) and the resulting high switching frequency capability, which raises the issues of significantly increased electromagnetic interference (EMI) in power converters [8][9][10][11][12][13][14]. As a result, costly and bulky EMI suppression measures are needed to suppress the emitted noise below the stringent EMI standard, which has become the main barrier to the increase in power density [15].…”
Section: Introductionmentioning
confidence: 99%
“…Wide band gap semiconductor materials, including silicon carbide and gallium nitride, have more advantages than silicon. Therefore, wide gap power devices play an increasingly important role in power electronic systems [1][2][3]. The critical electric field, saturation drift velocity, electron mobility, and thermal conductivity of wide band gap semiconductor materials are higher than those of silicon materials [4].…”
Section: Introductionmentioning
confidence: 99%