2010 27th International Conference on Microelectronics Proceedings 2010
DOI: 10.1109/miel.2010.5490496
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Micro force sensor fabricated in the LTCC technology

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Cited by 17 publications
(12 citation statements)
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“…However, the sensor is only tested to 450 °C [1114]. Another team in Novi Sad (Serbia) demonstrated in 2009 a better structure, but worse performance [15,16]. Two LTCC layers are added above the metal electrode to provide perfect protection, but the sensor sensitivity is only 25.6 kHz/bar.…”
Section: Introductionmentioning
confidence: 99%
“…However, the sensor is only tested to 450 °C [1114]. Another team in Novi Sad (Serbia) demonstrated in 2009 a better structure, but worse performance [15,16]. Two LTCC layers are added above the metal electrode to provide perfect protection, but the sensor sensitivity is only 25.6 kHz/bar.…”
Section: Introductionmentioning
confidence: 99%
“…In 2009, a research team in Novi Sad, Serbia, proposed a better structural model. The improved structural design and the use of LTCC material made this embedded structural sensor suitable for high-temperature and chemically aggressive environments [ 16 , 17 ]. In 2013, researchers at the North University of China, which has been committed to developing wireless, high-temperature passive LC ceramic pressure sensors, introduced a unique screen-printing process involving a sacrificial layer of ESL 4900 to prevent deformation of a capacitive embedded cavity during lamination and sintering.…”
Section: Research Status Of Wireless Passive Lc Sensors For Harsh mentioning
confidence: 99%
“…For the inductor fabrication dielectric tapes, (Heraeus CT 800; W.C. Heraeus, Hanau, Germany) were combined with compatible silver paste for conductive line printing (Heraeus TC 7305A; W.C. Heraeus) and for via filling (Heraeus TC 7304; W.C. Heraeus). A Heraeus material is chosen for realization of inductors structures with cavities, as this material is proven to be a good choice for realization of cavities embedded in the substrate, and it is relatively easy to work with. First, tapes were structured by means of laser micro‐machining to make via holes, alignment holes, and air‐gaps.…”
Section: Fabrication Of Designed Inductorsmentioning
confidence: 99%