“…Conventional metal deposition techniques such as evaporation, sputtering, and chemical vapor deposition bring considerable energy to the surface during the deposition process and are known to damage the surface molecular layer 271,272 and result in metalorganic interfaces with inconsistent, inhomogeneous, and leaky electrical conducting properties. 273,274 To minimize the impact of the metallization process, "soft" techniques, such as indirect deposition, [275][276][277] nano-particles deposition, [278][279][280] electrochemical methods, [281][282][283] "lift-off float-on (LOFO)," 284,285 mercury droplet contacts, 286,287 micro-contact printing, [288][289][290][291] have been specially designed and implemented to achieve more consistent results. The effect of a molecular layer on the SBH is found to be less consistent and predictable than its effect on the surface potential of the semiconductor or the metal.…”