Microfabricated hinges

Pister, Karl S.; Judy, Michael W.; Burgett, Steve R.; Fearing, Ronald S.

doi:10.1016/0924-4247(92)80172-y

Cited by 291 publications

(137 citation statements)

References 4 publications

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“…The notion of a micro-robot on a chip has been popularized by Brooks and Flynn [16] and Pister, Fearing, and co-workers [91,92,93]. We foresee a scenario in which these robots see wide application in micro-teleoperation in cramped areas, and in massively parallel handling of small biological and electromechanical systems.…”

Section: Robots On a Small Scale: Microroboticsmentioning

confidence: 99%

“…However, it is clear that for manipulators to extend far beyond the surface that they are mounted on, it is important to have 3-D structures. A promising new approach in this regard is the micro-hinge method of Pister et al [93]. This approach consists of actually fabricating components in 2-D, but providing them with the ability to rotate or slide into place resulting in the assembly of a 3-D structure.…”

Section: Robots On a Small Scale: Microroboticsmentioning

confidence: 99%

See 1 more Smart Citation

A Mathematical Introduction to Robotic Manipulation

Murray¹,

Sastry²,

Li³

2017

2,718

2,002

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Section: Robots On a Small Scale: Microroboticsmentioning

confidence: 99%

Section: Robots On a Small Scale: Microroboticsmentioning

confidence: 99%

A Mathematical Introduction to Robotic Manipulation

Murray¹,

Sastry²,

Li³

2017

2,718

2,002

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“…To process free-space beams, three-dimensional (3-D) structures are formed by out-of-plane rotation of parts hinged to the substrate [2]. Using these techniques, torsion mirror scanners with electrostatic [3] and electrothermal [4] drives have been demonstrated.…”

mentioning

confidence: 99%

Self-assembled 3-D silicon microscanners with self-assembled electrostatic drives

Syms

2000

IEEE Photon. Technol. Lett.

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Abstract-Three-dimensional, electrostatically driven resonant torsion mirror microscanners are constructed by surface tension powered out-of-plane rotation of parts formed in bonded silicon-on-insulator. Simultaneous self-assembly of the fixed electrodes using a below-substrate limiter mechanism allows scanning perpendicular to the assembly axis, and direct drive allows high-Q operation. Similar components have been fabricated by surface tension self-assembly, a method of mass-parallel fabrication of 3-D microstructures [5]. Rotation is powered by melting small pads of material (solder, glass, or photoresist) linking movable parts to the substrate. Recent work has used thick resist, with single crystal parts formed in bonded silicon-on-insulator (BSOI). Assembly has involved 45 rotation, with the final geometry fixed by a limiter [6]. Fig. 1(a) shows the mechanism used, which involves simultaneous rotation of two parts (FRAME-L and FRAME-R) in opposite directions. Catches on the parts prevent further motion when each has rotated through 45 . The assembly accuracy is extremely high, but the mechanism is bulky and, hence, most suitable for major component frames. Index Terms-MEMSThis two-part structure has been used in electrostatically driven torsion mirror scanners [6]. FRAME-R carried a mirror mounted on a torsion bar with its axis parallel to the substrate. The mirror carried one half of a comb electrostatic drive, while the other half was attached to the substrate. After assembly, the mirror could be excited into resonant torsional oscillation by a harmonic electrostatic force between the two halves of the drive. Because of the direct nature of the drive, quality factors as high as 60 were demonstrated.Manuscript received April 25, 2000; revised July 7, 2000. This work was supported by EPSRC.The author is with the Department of Electrical and Electronic Engineering, Imperial College, Exhibition Road, London, SW7 2BT, U.K. (e-mail: r.syms@ic.ac.uk).Publisher Item Identifier S 1041-1135(00)09600-2. The design had several limitations. First, the skewed electrode layout resulted in a high drive voltage, because of the weak electrostatic field. Second, there was a trade off between the voltage and the scan angle, because a reduction in separation between the halves of the comb could only be performed by lengthening the moving electrode fingers, reducing the angle of turn before they struck the substrate. Finally, only mirror axes parallel to the substrate could be used, to avoid the electrodes clashing.In this paper, we show how to overcome these difficulties by further self-assembly operations, and introduce a new mechanism that allows parts as small as the fixed half of the electrode to be reconfigured. Fig. 1(a) and (b) shows the mechanism, which is based on two cranks attached to a third movable part DRIVE near its hinge. Motion is prevented when the cranks reach the substrate. The accuracy of this mechanism is inherently low, as we show below, but it is sufficient for sub-component assembly. Here, we show how...

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“…The MUMPs is a three-layer polysilicon surface micromachining process, which has the following features: 1) polysilicon is used as the structural material; 2) deposited oxide (PSG) is used as the sacrificial layer and silicon nitride is used as electrical isolation between the polysilicon and the substrate [11]. [12] that allows 180° rotation. Link R 3 is connected to R 2 and R 4 by compliant joints as shown in Figure 1a.…”

Section: Methodsmentioning

confidence: 99%

Compliant MEMS Motion Characterization by Nanoindentation

et al. 2007

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Large out-of-plane displacements can be achieved when compliant mechanisms are utilized in MEMS. While mathematical and macroscopic modeling is helpful in building original designs, the actual MEMS device motion needs to be characterized in terms of the forces and displacements. A nanoindentation apparatus equipped with Berkovich diamond tip was used in an attempt to actuate and characterize the motion of the Bistable Spherical Compliant Micromechanism with a nonlinear (approximately cubic) mechanical response. Based on the obtained lateral force-displacement data it was concluded that the Berkovich diamond tip was too sharp, thus cutting through the polysilicon material of the MEMS device.

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Microfabricated hinges

Cited by 291 publications

References 4 publications

A Mathematical Introduction to Robotic Manipulation

A Mathematical Introduction to Robotic Manipulation

Self-assembled 3-D silicon microscanners with self-assembled electrostatic drives

Compliant MEMS Motion Characterization by Nanoindentation

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