Microfabricated Racetrack Inductors With Thin-Film Magnetic Cores for On-Chip Power Conversion

Harburg, Daniel V.; Hanson, Alex J.; Qiu, Jizheng; Reese, B.; Ranson, John; Otten, David; Levey, Christopher G.; Sullivan, Charles R.

doi:10.1109/jestpe.2018.2808375

Cited by 28 publications

(32 citation statements)

References 25 publications

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“…In addition, a magnetic thin-film core is a key feature to achieve a high inductance density, which is desired in applications such as switched-mode power supplies (SMPSs) 6 . A similar design of windings and thin-film cores can be seen in racetrack inductors 26 .…”

Section: Rfmentioning

confidence: 95%

“…17,25 , and buried oxide 14,15 . Racetrack 2012 28,153 Substrate-embedded racetrack windings, nanolaminated sputtered Co-Zr-O magnetic core.…”

Section: D Surface Micromachiningmentioning

confidence: 99%

“…Winding density improvement by high-aspect-ratio (high-AR) winding [10][11][12] , thin-film nanolaminated magnetic core 27,154 , axial anisotropy implementation 26,155 .…”

Section: Powermentioning

confidence: 99%

“…Substrate electrical isolation by suspended windings 34,35 , substrate-embedded windings 157,158 , thin-film nanolaminated magnetic core 37,38 , low-loss magnetic materials 26,38,101,102 , vertical laminated magnetic core 158 .…”

Section: Powermentioning

confidence: 99%

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MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

et al. 2021

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MEMS inductors are used in a wide range of applications in micro- and nanotechnology, including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance. This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication technologies, and discusses the challenges and opportunities of MEMS inductors for two emerging applications, namely, integrated power electronics and neurotechnologies. Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors. While 3D inductors are preferred for their high-quality factor, high power density, and low parasitic capacitance, in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation. These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters. From another perspective, 3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies. Finally, we discuss inspiring and emerging research opportunities for MEMS inductors.

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Section: Rfmentioning

confidence: 95%

“…17,25 , and buried oxide 14,15 . Racetrack 2012 28,153 Substrate-embedded racetrack windings, nanolaminated sputtered Co-Zr-O magnetic core.…”

Section: D Surface Micromachiningmentioning

confidence: 99%

“…Winding density improvement by high-aspect-ratio (high-AR) winding [10][11][12] , thin-film nanolaminated magnetic core 27,154 , axial anisotropy implementation 26,155 .…”

Section: Powermentioning

confidence: 99%

Section: Powermentioning

confidence: 99%

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MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

et al. 2021

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“…Magnetic components (inductors and transformers) are typically the largest and most lossy components in power converters [1]. While increasing converter switching frequencies can reduce the required size of passive components, size reductions achievable through frequency increases are often limited by core loss (such as in transformers and resonant inductors) [2]; moving beyond operating frequency limits dictated by core loss characteristics can result in unacceptable efficiencies.…”

Section: Introductionmentioning

confidence: 99%

Measurements and Performance Factor Comparisons of Magnetic Materials at High Frequency

Hanson

Belk

Lim

et al. 2016

IEEE Trans. Power Electron.

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180

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Abstract-The design of power magnetic components for operation at high frequency (HF, 3-30 MHz) has been hindered by a lack of performance data and by the limited design theory in that frequency range. To address these deficiencies, we have measured and present core loss data for a variety of commercially available magnetic materials in the HF range. In addition, we extend the theory of performance factor for appropriate use in HF design. Since magnetic materials suitable for HF applications tend to have low permeability, we also consider the impact of low permeability on design. We conclude that, with appropriate material selection and design, increased frequencies can continue to yield improved power density well into the HF regime.

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Flexible Mini‐Inductors with Ultra‐High Inductance Density Directly Cut from Soft Magnetic Amorphous Alloys by Femtosecond Laser

Chen,

Zhang,

Wang

et al. 2024

Adv Funct Materials

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Inductors are indispensable parts in power modules of electronic devices. With the rapid development of flexible and wearable electronic devices, developing flexible micro‐inductors with large energy storage has become an urgent task. In this research, a sophisticated femtosecond laser ablation technique is employed to craft circular spiral mini‐inductors via selective etching of soft magnetic amorphous alloy ribbons. Remarkably, while these inductors possess dimensions akin to human fingerprints, they demonstrate an impressively elevated inductance value of ≈1.15 µH at 1 MHz. The inductance density is ≈280–390 nH mm−2, which is ≈10 times larger than conventional circular spiral inductors and is attributed to the high permeability of the amorphous alloys. Furthermore, the inductors showcase commendable flexibility, marked by stellar elasticity and a bending endurance exceeding 2500 cycles, thanks to the amorphous alloys' superior elastic strain limit. When integrated with an LM2576‐3.3BT buck converter, the fabricated inductor achieved a peak power conversion efficiency nearing 70%. These findings underscore the potential of such flexible mini‐inductors in the landscape of flexible electronics.

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Microfabricated Racetrack Inductors With Thin-Film Magnetic Cores for On-Chip Power Conversion

Cited by 28 publications

References 25 publications

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

Measurements and Performance Factor Comparisons of Magnetic Materials at High Frequency

Flexible Mini‐Inductors with Ultra‐High Inductance Density Directly Cut from Soft Magnetic Amorphous Alloys by Femtosecond Laser

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