Microjet Cooler with Distributed Returns

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

“…T.-W. Wei 1,2 , H. Oprins 1 , V. Cherman 1 , G. Van der Plas 1 , I. De Wolf 1,3 , E. Beyne 1 and M. Baelmans 2 email: tiwei.wei@imec.be 1 imec, Leuven, Belgium, 2 Dept. Mech.…”

High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler

“…The cooling performance in terms of thermal resistance and pumping power of the fabricated polymer cooler with a 4×4 array of inlets (0.25 K/W or 0.16 cm 2 .K/W for a pumping power of 0.4 W) has been compared in Fig. 16 with published data in literature for impingement coolers fabricated using various ma-terials: Si [3][4][5][6][7], ceramic [8], metal [9] and plastic [10][11][12] presented in the introduction section. From the thermal resistance versus pump power benchmarking chart in Fig.…”

“…The drawback of this Si processing of the cooler is the high fabrication cost. Other fabrication methods for nozzle diameters of a few hundred µm have been presented for ceramic [8] and metal [9]. Low cost fabrication methods, including injection molding [10,11] and 3D printing [12] have been introduced for much larger nozzle diameters (mm range) with larger cooler dimensions.…”

Hybrid Solid- and Liquid-Cooling Solution for Isothermalization of Insulated Gate Bipolar Transistor Power Electronic Devices

“…Silk et al [11] demonstrated that a two-phase spray cooling with PF-5060 as the working fluid can achieve a heat transfer coefficient of 24 000 W/m 2 -K. Compared to microchannel cooling and spray cooling, jet impingement cooling can offer much higher heat transfer capability. For example, Natarajan and Bezama [12] demonstrated that a single-phase water submerged jet can reach a heat transfer coefficient as high as 52 000 W/m 2 However, these high heat flux cooling solutions, when applied on the back side of the direct-bonded copper (DBC) substrate and designed for thermal management of the entire IGBT module, cannot remove the nonuniform temperature distribution on the individual IGBT chips. Fig.…”