Micromachined circuits for millimeter- and sub-millimeter-wave applications

Katehi, L.P.B.; Rebeiz, Gabriel M.; Weller, Thomas M.; Drayton, R.F.; Cheng, H.; Whitaker, J.F.

doi:10.1109/74.242171

Cited by 51 publications

(16 citation statements)

References 13 publications

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“…Metalizations were then added, and two or three wafers were bonded together. In subsequent studies, the microshield lines were designed to take on more of a microstrip style and then used in a large variety of millimeter-wave circuit demonstrations [3]- [9]. Of particular note is the exceptional millimeter-wave filter performance achieved [5]- [7].…”

mentioning

confidence: 99%

Micromachined rectangular-coaxial transmission lines

Reid

Marsh

Webster

2006

IEEE Trans. Microwave Theory Techn.

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Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing this collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden to Department of Defense, Washington Headquarters Services, Directorate for Information Operations and Reports (0704-0188), 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302. Respondents should be aware that notwithstanding any other provision of law, no person shall be subject to any penalty for failing to comply with a collection of information if it does not display a currently valid OMB control number. PLEASE DO NOT RETURN YOUR FORM TO THE ABOVE ADDRESS. REPORT DATE (DD-MM-YYYY) SPONSOR/MONITOR'S ACRONYM(S)AFRL-SN-HS SPONSORING / MONITORING AGENCY NAME(S) AND ADDRESS(ES)Electromagnetics Technology Division Sensors Directorate Air Force Research Laboratory 80 Scott Drive Hanscom AFB MA 01731-2909 SPONSOR/MONITOR'S REPORT NUMBER(S) AFRL-SN-HS-JA-2006-0062 DISTRIBUTION / AVAILABILITY STATEMENTDISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. SUPPLEMENTARY NOTESClearance Number ESC-06-0062 ABSTRACTRectangular-coaxial (recta-coax) transmission lines fabricated through a three-dimensional micromachining process are presented. These lines are shown to have significant advantages over competing integrated transmission lines such as microstrip and coplanar waveguides. Design equations are presented for impedance, loss, and frequency range. The equations are confirmed with simulations and measurements. The quality factor of shorted lambda/4 resonators is measured to be 156 at 60 GHz. This corresponds to a line loss of 0.353 dB/cm. Advantages of these lines for passive millimeter-wave circuits including ease of signal routing, high isolation, and signal crossovers are demonstrated with realized lines and couplers. SUBJECT TERMSCoplanar waveguides, couplers, filters, microstrip, millimeter-wave circuits, resonators

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mentioning

confidence: 99%

Micromachined rectangular-coaxial transmission lines

Reid

Marsh

Webster

2006

IEEE Trans. Microwave Theory Techn.

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“…2) A group of the low-pass prototype parameters is given from the desired filter response; the required external and internal coupling coefficient can be calculated using these parameters [29]. 2 [Online]. Available: http://www.microchem.com/products/su_eight.htm 3) Decide the type of the coupling structure for external and internal coupling and look up the design curve to find the optimal physical dimension.…”

Section: B Design Flowmentioning

confidence: 99%

“…The will greatly simplify the expressions for resonating frequencies. The loaded resonating frequency for the cavity can be written as (2) Similarly, when a magnetic wall is inserted at the symmetry plane, the loaded resonating frequency for the cavity is (3) If we keep , since , we can see , and this indicates a capacitive coupling is achieved.…”

Section: A Design and Analysis Of A Novel Capacitive Coupling Structurementioning

confidence: 99%

“…The proposed technology can also introduce more design flexibilities that help create new designs/topologies that might be hard from a traditional mechanical machined waveguide: the diameters for different pillars can be designed to be different with each other; the height of the pillars can also be continuously controlled from several micrometers up to 1-2 mm; SU-8 2150 can reach as high as 600 m for the single spin coating, and repeatable and high yield pillar array with aspect ratio of 25 or higher can be achieved. 2 Without the requirements for standard via dimensions and standard board thicknesses, this method extends the design space.…”

Section: Proposed Polymer Core Conductor Surface Micromachining Imentioning

confidence: 99%

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Surface Micromachining Polymer-Core-Conductor Approach for High-Performance Millimeter-Wave Air-Cavity Filters Integration

Pan

Tentzeris

et al. 2008

IEEE Trans. Microwave Theory Techn.

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Abstract-This paper presents a novel approach to integrate high-performance millimeter wave filters on top of wafers. The proposed method eliminates the dielectric loss by elevating cavity-based filters into the air with the aid of the polymer-core conductor surface micromachining technology. The electrical fields of the cavity are thus entirely in air. A coplanar waveguide input and output interface is designed for easy integration with other planar electronics. Several 60-GHz ( -band) air-cavity filters with superior performances, including two two-pole filters and one four-pole transmission zero filter using a novel capacitive coupling scheme, are developed and characterized to demonstrate advantages of the proposed technology. The filters exhibit excellent performances. Insertion losses as low as 1.45 dB for a two-pole filter and 2.45 dB for a four-pole transmission-zero filter have been observed at 60 GHz. Design curves and parametric analyses are included to help readers better understand key factors in optimizations. The proposed technology is capable of integrating high-performance millimeter-wave cavity filters on top of wafers, while providing easy integration with other electronic components.

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“…However, the geometric structure of these conventional transmission lines has dielectric loss and dispersion characteristics due to the semiconductor substrate supporting the transmission line, which degrades circuit performance in the highfrequency range. Recently, to reduce this loss problem, studies of low-loss transmission lines using MEMs technology has proceeded in several groups [3,4]. However, the proposed transmission-line structures have a better advantage with regard to the loss characteristic at high frequency than conventional transmission lines, while the latter have the structural disadvantage of a very complex process and are not compatible with conventional MMIC fabrication technology.…”

Section: Introductionmentioning

confidence: 99%