Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Syst 1999
DOI: 10.1109/memsys.1999.746745
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Micromachined relay which utilizes single crystal silicon electrostatic actuator

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Cited by 56 publications
(28 citation statements)
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“…As a result of these advantages, in combination with silicon offering the largest variety of stable and standardized wafer-scale micromachining processes and highly developed etching tools, silicon is still the best suitable material for integrated microsystems with high demands on mechanical reliability [1]. Monocrystalline silicon has been successfully applied to a variety of MEMS devices including pressure sensors, accelerometers [51], undeformable sub-nm-flatness micromirror arrays [52], and robust microrelays [53,54].…”
Section: A) Monocrystalline Silicon As Structural and Electrical Matementioning
confidence: 99%
“…As a result of these advantages, in combination with silicon offering the largest variety of stable and standardized wafer-scale micromachining processes and highly developed etching tools, silicon is still the best suitable material for integrated microsystems with high demands on mechanical reliability [1]. Monocrystalline silicon has been successfully applied to a variety of MEMS devices including pressure sensors, accelerometers [51], undeformable sub-nm-flatness micromirror arrays [52], and robust microrelays [53,54].…”
Section: A) Monocrystalline Silicon As Structural and Electrical Matementioning
confidence: 99%
“…Various actuation mechanisms have been used in microrelays, including electrostatic, electrothermal, and electromagnetic actuation. Among these, electrostatic actuation [2]- [19] is the most popular approach because it provides fast response time and consumes little power. However, electrostatic actuation force is typically weak, resulting in high contact resistance and possible contact welding during relay operation.…”
Section: Introductionmentioning
confidence: 99%
“…One of the major failure modes which has been recently highlighted is material transfer from anode to cathode [1][2][3][4][5][6]. This phenomenon appears under non-arcing conditions in hot switching tests, i.e.…”
Section: Introductionmentioning
confidence: 99%