2010
DOI: 10.1049/el.2010.2193
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Micronetworking: reliable communication on 3D integrated circuits

Abstract: AcknowledgmentsThe completion of this thesis has been possible thanks to the help and contribution of many. I would like to acknowledge their extraordinary support in making this research a reality. First, I would like to thank the government of the Dominican Republic and the Ministry of Higher Education for giving me the opportunity to come to study at Utah State University.

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Cited by 2 publications
(3 citation statements)
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“…In [4] a switching network called the micronetworking for inter-chip communication to utilise the TSV redundancy was proposed. A switching node with three tracks per tier is given in [4] but for the given example shown in Fig.…”
Section: Fig 1 Major Previous Work In Tsv Redundancymentioning
confidence: 99%
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“…In [4] a switching network called the micronetworking for inter-chip communication to utilise the TSV redundancy was proposed. A switching node with three tracks per tier is given in [4] but for the given example shown in Fig.…”
Section: Fig 1 Major Previous Work In Tsv Redundancymentioning
confidence: 99%
“…A switching node with three tracks per tier is given in [4] but for the given example shown in Fig. 2a a switching node with four tracks, shown in Fig.…”
Section: Fig 1 Major Previous Work In Tsv Redundancymentioning
confidence: 99%
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