Microstructure, melting behavior and thermal conductivity of the Sn–Zn alloys

Manasijević, Dragan; Balanović, Ljubiša; Marković, Ivana; Gorgievski, Milan; Stamenković, Uroš; Božinović, Kristina

doi:10.1016/j.tca.2021.178978

Cited by 13 publications

(4 citation statements)

References 22 publications

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“…The standard uncertainty (0.68 level of confidence) for the thermal diffusivity measurements is ± 3% [21]. The total standard uncertainty for the thermal conductivity is estimated to be ± 6% [14].…”

Section: Metalmentioning

confidence: 93%

“…The TA Instruments xenon-flash compact benchtop apparatus (Discovery Xenon Flash DXF-500) was used to measure thermal diffusivity from 25 to 250 °C. More information on the fundamental theoretical concepts and practical procedures underlying the used xenon-flash method can be found in [13][14][15][16][17]. The cast Cu-Bi alloy samples were machined into round disks (12.6 mm in diameter and 2 mm thick, with two ground plane parallel end-faces) before being annealed at 200 °C for 48 hours.…”

Section: Methodsmentioning

confidence: 99%

“…Specific heat capacity values were calculated using the CALPHAD method, and densities of the investigated alloys at room temperature were determined using the indirect Archimedean method [14,16] with distilled water (0= 0.99679 kgm -3 ) and a Mettler Toledo electronic instrument.…”

Section: Methodsmentioning

confidence: 99%

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Thermal transport properties and microstructure of the solid Bi-Cu alloys

Manasijević¹,

Balanović²,

Marković³

et al. 2022

Metall Mater Eng

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Thermal transport properties of solid Bi-Cu alloys have been investigated over a wide composition range and temperature range ranging from 25 to 250 °C. The flash method was used to determine thermal diffusivity. Thermal diffusivity was discovered to decrease continuously with increasing temperature and bismuth content. The indirect Archimedean method was used to determine the density of the Bi-Cu alloys at 25 °C. The obtained results show that the density of the studied alloys decreases slightly as the copper content increases. Thermal conductivity of the alloys was calculated using measured diffusivity, density, and a calculated specific heat capacity. The thermal conductivity of the studied Bi-Cu alloys decreases with increasing temperature and bismuth content, similar to thermal diffusivity. SEM with energy dispersive X-ray spectrometry (EDS) and differential scanning calorimetry (DSC) were used to examine the microstructure and melting behavior of Bi-Cu alloys, respectively. The eutectic temperature was measured to be 269.9±0.1 °C, and the measured phase transition temperatures and heat effects were compared to thermodynamic calculations using the CALPHAD method.

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Section: Metalmentioning

confidence: 93%

Section: Methodsmentioning

confidence: 99%

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Thermal transport properties and microstructure of the solid Bi-Cu alloys

Manasijević¹,

Balanović²,

Marković³

et al. 2022

Metall Mater Eng

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“…This encompasses technologies like system integration packaging and 3D packaging [2] . In this evolving landscape, Snbased solder materials such as Sn-Ag-Cu, Sn-Cu, Sn-Ag [3] , Sn-Zn [4] , and Sn-Bi [5] have gained prominence. Notably, the SAC system is emerging as a favored alternative to Sn-Pb solder, attributed to its comparatively superior performance.…”

Section: Introductionmentioning

confidence: 99%

Interfacial morphology and reliability of GaN nanocomposite Sn-Ag-Cu lead-free braze joints

Liu,

Qu,

et al. 2024

J. Phys.: Conf. Ser.

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GaN nanoparticles, in varying mass fractions (0 wt%, 0.20 wt%, 0.40 wt%, 0.60 wt%, and 0.80 wt%), were integrated into a Sn-3.0Ag-0.5Cu lead-free solder using mechanical mixing followed by reflow soldering. The solders underwent isothermal aging at 170°C for different durations to assess the influence of GaN content on the melting characteristics, wettability, and growth behavior of the intermetallic compound (IMC) in the Sn-3.0Ag-0.5Cu solder. Findings indicate that GaN incorporation does not markedly alter the melting point of SAC305. However, a moderate GaN addition enhances the wettability of Sn-3.0Ag-0.5Cu, with the optimal effect observed at 0.40 wt% GaN, where the wettability is improved by 61.5% relative to the base solder. Furthermore, GaN addition serves to curtail the IMC layer’s growth, which, while it thickens with prolonged isothermal aging, does so at a rate governed by diffusion. At 0.40 wt% GaN, the diffusion coefficient is determined to be 1.453×10-15 m2/s, underscoring the superior performance of the novel SAC305-0.4GaN composite solder.

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Structure and properties of low-Ag SAC solders for electronic packaging

Zhang

Wang

et al. 2022

J Mater Sci: Mater Electron

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Microstructure, melting behavior and thermal conductivity of the Sn–Zn alloys

Cited by 13 publications

References 22 publications

Thermal transport properties and microstructure of the solid Bi-Cu alloys

Thermal transport properties and microstructure of the solid Bi-Cu alloys

Interfacial morphology and reliability of GaN nanocomposite Sn-Ag-Cu lead-free braze joints

Structure and properties of low-Ag SAC solders for electronic packaging

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