Microstructuring of Glasses

Hülsenberg, Dagmar; Harnisch, Alf; Bismarck, Alexander

doi:10.1007/978-3-540-49888-9

Cited by 80 publications

(80 citation statements)

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“…Furthermore, increasing the number of pulses or irradiation time beyond that required to achieve the maximum exit hole diameter, also increased the size of the HAZ. The existence of a HAZ around laser machined features in glass has been reported by several authors in the literature [17,19,24].…”

Section: Microvia Characterisationmentioning

confidence: 74%

“…This is generally expected since the laser -material interaction theory is very complex and it has been described by several authors that excimer laser ablation in glass takes place with both athermal (material removal occurs by direct breaking of bonds) and thermal (material removal occurs by heating, melting and ejection) mechanisms depending on the wavelength and process parameters [17][18][19]. Since a recast layer around the entry and exit holes was observed here, it can be assumed that at least some of the material was removed by thermal ablation.…”

Section: Microvia Characterisationmentioning

confidence: 99%

“…Other factors such as the numerical aperture of the optics, beam divergence and shadowing effects also favour a tapered profile of the holes. This means that along with laser fluence, the optical set-up of the laser system also plays an important role in the final taper profile achieved [17].…”

Section: Process Optimisationmentioning

confidence: 99%

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Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects

2012

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Section: Microvia Characterisationmentioning

confidence: 74%

Section: Microvia Characterisationmentioning

confidence: 99%

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Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects

2012

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“…The properties of elemental silicon are well known, especially those of the commonly used single crystal format. Glass, in turn, is a broad class of related materials (Hülsenberg, Harnisch, & Bismarck, 2008), each of them possessing different materials properties, including softening temperature and coefficient of thermal expansion. During the fabrication process, these properties may affect process temperatures, wafer bending, and subsequently bonding.…”

Section: A Materialsmentioning

confidence: 99%

Microchip technology in mass spectrometry

Sikanen

Franssila

Kauppila

et al. 2009

Mass Spectrom. Rev.

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Microfabrication of analytical devices is currently of growing interest and many microfabricated instruments have also entered the field of mass spectrometry (MS). Various (atmospheric pressure) ion sources as well as mass analyzers have been developed exploiting microfabrication techniques. The most common approach thus far has been the miniaturization of the electrospray ion source and its integration with various separation and sampling units. Other ionization techniques, mainly atmospheric pressure chemical ionization and photoionization, have also been subject to miniaturization, though they have not attracted as much attention. Likewise, all common types of mass analyzers have been realized by microfabrication and, in most cases, successfully applied to MS analysis in conjunction with on-chip ionization. This review summarizes the latest achievements in the field of microfabricated ion sources and mass analyzers. Representative applications are reviewed focusing on the development of fully microfabricated systems where ion sources or analyzers are integrated with microfluidic separation devices or microfabricated pums and detectors, respectively. Also the main microfabrication methods, with their possibilities and constraints, are briefly discussed together with the most commonly used materials.

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“…Kristal kuarsa ini mempunyai sifat material unik yaitu mampu menghasilkan tegangan listrik ketika diberi tekanan mekanikal dan juga sebaliknya, dimana sifat ini dikenal dengan nama efek piezoelektrik. Sifat inilah yang dimanfaatkan untuk menghasilkan resonansi listrik-mekanik, sehingga kristal akan bergetar pada frekuensi Teknik etsa adalah proses pembentukan pola dengan menggunakan asam kuat untuk mengikis bagian permukaan yang tidak terlindungi masking [4]. Masking atau resist digunakan untuk melindungi bagian material yang diperlakukan etsa.…”

Section: Pendahuluanunclassified

The effectiveness study of SnCl2.2H2O masking on the formation of QCM profile using wet etching technique with KOH solution

Rusly

Santjojo

Sakti

et al. 2017

Nat-B

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SnCl2.2H2O has been successfully utilized to produce isotropic profile on the surface of a SiO2 crystall by a wet etching procces. The etching process was carried out by using a 40% KOH solution. In this research, the wet etching method is carried out by optimizing the etch time which was varied for 0.5 hour, 1 hour, 1,5 hour. The profile was determined by applying a SnCl2.2H2O on the surface of a QCM. The mask was applied by using a spray coating technique. The SnCl2.2H2O material was chosen as the masking material because it has a high adhesive property to SiO2, does not react to the KOH etching solution and is corrosion resistance as well as low cost. The etching profile surface results and etch depth (z) were determined using topography measurement system (TMS 1200). The etching rate with 40% KOH during etching time of 30 minutes, 60 minutes, 90 minutes were 4.36 μm, 4.56 μm and 5.79 μm respectively. The optimum QCM surface isotropic profile was obtained at the etching rate of 4.56 μm / h by 60 minutes etching.

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Microstructuring of Glasses

Cited by 80 publications

References 0 publications

Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects

Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects

Microchip technology in mass spectrometry

The effectiveness study of SnCl2.2H2O masking on the formation of QCM profile using wet etching technique with KOH solution

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