Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad

Cheng, Fan; Zhao, Ji; Zhang, Lei; Wong, Yoke San; Gao, Hong; Zhou, Wansong

doi:10.1016/j.jmatprotec.2013.09.010

Cited by 37 publications

(24 citation statements)

References 18 publications

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“…Dwell time at each dwell point is the product of the dwell time density at the point and the area enclosed by the point, of which the former can be obtained by various algorithms [27,28] and the later by Eq. (8). Dwell time at local dwell points (e.g.P(i)) is implemented during the path interval from P(i − 1/2) (the middle location between P(i − 1) and P(i)) to P(i + 1/2).…”

Section: Deterministic Correction Of the Pad Shapementioning

confidence: 99%

“…Sub-aperture polishing processes are characterized by a small tool whose dwell time map on the optic is implemented by computer control, thus they are also known as computer controlled optical surfacing (CCOS). Various CCOS processes have been developed since the 1970s, such as small tool computer controlled polishing [7,8], Magnetorheological Finishing [9], ion beam finishing [10], and so forth [11,12]. These processes have brought great promotion of surface figure.…”

Section: Introductionmentioning

confidence: 99%

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Deterministic measurement and correction of the pad shape in full-aperture polishing processes

Liao¹,

Zhang²,

Xie³

et al. 2015

J. Eur. Opt. Soc.-Rapid Publ.

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Full-aperture polishing is a significant process in fabricating large optical flats because it restrains Mid-Spatial Frequency errors and removes material quickly on the whole optic surface. Nevertheless, optical flats fabricated by full-aperture polishing generally fail to meet the stringent requirement of surface figure, which has to be corrected by sub-aperture polishing processes. Surface figure of optical flats in full-aperture polishing processes is primarily dependent on the pressure distribution uniformity which correlates intensively with the lap shape. At present, practical and precise means are urgently desired for measuring and correcting the lap shape, especially the polyurethane pad lap. In the study, we present a novel method for deterministic measurement of the pad shape. The method obtains the height of the pad at spirally distributed locations implemented by the revolution of the pad and translation of the laser displacement sensor. The pad shape in terms of matrixes whose elements representing the heights at the corresponding locations is then calculated by interpolation algorithm based on the obtained data. Further, we propose a method for deterministic correction of the pad shape utilizing a small conditioning tool. The dwell time algorithm and implementation strategy for the dwell time are provided for common full-aperture polishers. These solutions for the deterministic measurement and correction of the pad shape have been validated on a full-aperture polisher with polyurethane pad. The polishing experiments revealed that the optic surface figure was obviously improved.

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Section: Deterministic Correction Of the Pad Shapementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Deterministic measurement and correction of the pad shape in full-aperture polishing processes

Liao¹,

Zhang²,

Xie³

et al. 2015

J. Eur. Opt. Soc.-Rapid Publ.

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“…From the tribological perspective, free abrasive polishing belongs to a threebody wear mechanism, in which abrasive particles are free to roll and slide between two surfaces and cause wear on at least one of the two surfaces. 12,13 Compared to free abrasive polishing, abrasives are inlayed in the matrix in the fixed abrasive polishing to confirm that each particle has its own position. However, it is difficult to get the abrasives uniformly distributed in the tools, especially when ultrafine particles are aggregated together.…”

Section: Introductionmentioning

confidence: 99%

The effects of abrasive yielding on the polishing of SiC wafers using a semi-fixed flexible pad

2015

Proceedings of the Institution of Mechanical Engineers, Part B:

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A newly developed sol-gel (SG) polishing pad can satisfy the processing demands of SiC wafers by providing scratch-free polished surfaces with nano-roughness. The main characteristic of this polishing tool is the semi-fixed abrasive together with the flexible matrix. In this article, contrastive experiments involving polishing of SiC wafers with three different types of tools were conducted to confirm the machining mechanism of the SG polishing pad. The results indicate that the abrasives in the pad exhibit yielding effects during the polishing process, contributing to the achievement of a mirrorlike wafer surface. In addition, larger abrasives can be chosen for the SG polishing pad to obtain relatively high wafer surface quality instead of smaller ones, thereby avoiding the agglomeration problem of ultrafine abrasives.

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“…The abrasive particle size, the elastic modulus of the pad and the contact pressure played a 33 predominant role in wear depth. Fan et al [76] extended the model and studied not only the effects of conventional parameters used in prediction of free-abrasive process (FAP) like normal force, angular velocity, spindle speed but also investigated the effect of tool path curvature, grain size, polishing slurry properties.…”

Section: Materials Removal Models Using Grain-workpiece Interactionmentioning

confidence: 99%

“…Later the tool is retracted, and the machined surface is measured using a laser profilometer with a spacing of 100µm (resolution). 76 (a) (b) the shaft is in contact, the pressure and material removal keep increasing till 30N, and it is expected to increase further. A similar phenomenon that is observed in hard pad is also 78 observed in the soft pad, where for two different loading (15N and 25N) where the contact area increases by 57.62% for almost same maximum material removal depth of 198 µm ±4.24 µm.…”

Section: Process Parametersmentioning

confidence: 99%

Effect of polishing disc compliance on the pressure distribution and material removal

Arunachalam¹

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Polishing is a key manufacturing process which has become inevitable in many industries such as shipbuilding, aerospace, automobile and bio-medical sectors. The compliant polishing tools (CPTs) are commonly used in industries, and there are different variants of the compliant polishing tools such as disc, wheel or belt types. Initially in this dissertation, in order to reduce the ambiguity involved in tool selection, two multi-criteria decision-making methods (MCDMs) methods are considered for a case study involving the selection of optimal polishing tools at different polishing stages. The CPTs are usually preferred to the rigid tools for the

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Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad

Cited by 37 publications

References 18 publications

Deterministic measurement and correction of the pad shape in full-aperture polishing processes

Deterministic measurement and correction of the pad shape in full-aperture polishing processes

The effects of abrasive yielding on the polishing of SiC wafers using a semi-fixed flexible pad

Effect of polishing disc compliance on the pressure distribution and material removal

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