1995
DOI: 10.1016/0098-1354(94)e0038-o
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Modeling and control of microelectronics materials processing

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Cited by 48 publications
(17 citation statements)
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“…For example, an integrated circuit consists of several layers of chemically altered and patterned thin films in order to achieve desired electrical characteristics [13], [8]. The performance of such devices depends not only on the sharpness of these patterns and the interfaces between the layers of these films, but also heavily on the resulting microstructure of the film material.…”
Section: Introductionmentioning
confidence: 99%
“…For example, an integrated circuit consists of several layers of chemically altered and patterned thin films in order to achieve desired electrical characteristics [13], [8]. The performance of such devices depends not only on the sharpness of these patterns and the interfaces between the layers of these films, but also heavily on the resulting microstructure of the film material.…”
Section: Introductionmentioning
confidence: 99%
“…The modelling of plasma processes requires a thorough understanding of the plasma dynamics. The process is known to be sensitive to various parameters, such as chamber geometry, accuracy of measurement sensors, chemical disturbances, etc., [1].…”
Section: Introductionmentioning
confidence: 99%
“…More recently, however, there has been intense interest in controlling problems whose models have significantly higher complexity, necessitating discretizations of much higher order. Such problems include semiconductor manufacturing reactors (e.g., Badgewell et al, 1994;Aling et al, 1997), reverse-flow and circulating-loop reactors (e.g., Nieken et al, 1994;Hua et al, 1998), control of transitional hydrodynamic flows (Joshi et al, 1997;Carlson and Lumley, 1997), or instabilities in turbines (Badmus et al, 1996;Paduano et al, 1994). Problems with complicated geometries and/or sharp variations of solutions or system parameters make the use of larger discretization models unavoidable (Aling et al, 1996;Aling et al, 1997;Bangia et al, 1997;Graham et al, 1993;Chakravarti et al, 1995).…”
Section: Of Study Introductionmentioning
confidence: 99%