Modeling and high frequency characterization of short links for high performance integrated circuits. Experimental validation and CAD formulas

Modeling and impedance matching of bonding wires in multi-chip interconnection of electric sensor

“…Firstly, as shown in Fig. 2, a single bonding wire is modeled based on Gaussian function [4]. The model can be expressed as…”

“…where 𝑔 is the outer contour of the bonding line, 𝐴 ⃗ is the magnetic vector potential along g, produced by I, and 𝑑𝑙 ⃗ is a vector differential length along g. Then, 𝐴 ⃗ is defined as [4] 𝐴…”

“…At low frequencies, it is considered that current is uniformly distributed over the cross section of the bonding wire. Then based on the concept of partial inductance, the partial self-inductance (Lps) can be expressed as [4]…”

“…The method of moments (MoM) is applied in reference [3] to extract the self-and mutual inductances of bonding wires. In addition, the parasitic inductances are also extracted using the partial element equivalent circuit (PEEC) method in reference [4]. However, these methods rely on 3D modeling and simulation to only extract parasitic parameters, such as parasitic inductance.…”