Modeling and simulation method of trajectory in double-side autonomous grinding considering the dynamic friction coefficient

Wang, Nina; Zhang, Guangpeng; Ren, Ling; Li, Yongchang

doi:10.1007/s00170-022-10473-z

Cited by 4 publications

(3 citation statements)

References 22 publications

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“…We define the friction coefficient ratio k OB as the ratio of the friction coefficient µ B to the friction coefficient µ O , whose expression is shown in Equation (12).…”

Section: Motion Model Of Workpiecementioning

confidence: 99%

“…Yang proposed a method to measure the workpiece rotational speed and established the mathematical model considering the workpiece rotational speed through the track point distribution (NUTPD) to evaluate the trajectory uniformity [ 11 ]. Wang demonstrated a method of trajectory in double-side autonomous grinding considering the dynamic friction coefficient [ 12 ]. Deng et al revealed the influence of polishing process parameters on the surface quality of sapphire [ 13 ] and then obtained and experimented on the sapphire DS-CMP processing plan based on the Box–Behnken design [ 6 ], given the optimal process parameter combinations, and obtained the maximum MRR of 387.59 nm min −1 .…”

Section: Introductionmentioning

confidence: 99%

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Analysis of the Influence of the Motion State of Ultra-Thin Sapphire Based on Layer-Stacked Clamping (LSC)

et al. 2023

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Ultra-thin sapphire wafer processing is receiving increasing attention in the LED substrate industry. In the cascade clamping method, the motion state of the wafer determines the uniformity of material removal, while the motion state of the wafer is related to its friction coefficient in the biplane processing system, but there is little relevant literature discussing the relationship between the motion state of wafer and friction coefficient. In this study, an analytical model of the motion state of sapphire wafers in the layer-stacked clamping process based on the frictional moment is established, the effect of each friction coefficient on its motion is discussed, the base plate of different materials and different roughness are experimentally studied, the layer-stacked clamping fixture is prepared in this way, and finally the failure form of the limiting tab is analyzed experimentally. The theoretical analysis shows that the sapphire wafer is mainly driven by the polishing plate, while the base plate is mainly driven by the holder, and the rotation speed of the two is not the same; the material of the base plate of the layer-stacked clamping fixture is stainless steel, the material of the limiter is glass fiber plate, and the main form of failure of the limiter is to be cut by the edge of the sapphire wafer and damage the material structure.

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“…We define the friction coefficient ratio k OB as the ratio of the friction coefficient µ B to the friction coefficient µ O , whose expression is shown in Equation (12).…”

Section: Motion Model Of Workpiecementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Analysis of the Influence of the Motion State of Ultra-Thin Sapphire Based on Layer-Stacked Clamping (LSC)

et al. 2023

View full text Add to dashboard Cite

show abstract

“…However, the current studies need more data linkage and have limitations concerning methods and theories. For example, the studies carried out a two-dimension kinematics model of the grains [22,23], neglecting the wheel's angular displacement [24,25]. The workpiece surface accuracy [26] has been mentioned, and uneven material removal is considered responsible for the dimension accuracy.…”

Section: Introductionmentioning

confidence: 99%

Effect of the vibration displacement responses on end grinding processed surface height

Zou,

Li,

Xiu

et al. 2023

Int J Adv Manuf Technol

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End grinding is a mechanical processing technology that shapes the machining surface with high precision and efficiency. However, there are still some unknown links between the time domain transient response and the workpiece surface under the processing of the end grinding.Besides, the enclosed grinding condition makes it hard to observe the links from the experiments.Numerical simulation is adopted to find the effects of the time domain transient response on processed surface height. This paper presents a grinding system simulation model, which combines the grinding force, the time domain transient response of the wheel, and the rotation speed of the workpiece and wheel. Firstly, the lumped mass method is applied to propose a dynamic model.Secondly, calculate the dynamic grinding force with effective abrasives positions and workpiece surface heights. Thirdly, examine the simulation results consistent with the experiment results.Finally, analyze the simulation results to explore the time domain transient response's effects on the machined surface quality. The result illustrates the change in the workpiece surface height during the grinding. It also shows that the wheel's angle displacement may be responsible for the varying surface height on the workpiece surface. At the same time, the longer length of grinding time causes a higher grinding surface. Furthermore, the research is noteworthy for improving the workpiece surface quality.

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Simulation and experimental research on the abrasive trajectories of plane lapping based on rotary swing drive

Zhu,

Gao,

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part B:

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In the pursuit of achieving exceptional surface shape accuracy for MPCVD (Microwave Plasma Chemical Vapor Deposition) polycrystalline diamond wafers during the free abrasive lapping process, plane lapping based on rotary swing drive was employed in this study. The crux of this study lay in the development of a comprehensive kinematic model, scrutinizing the motion behavior of abrasive particles, and probing the influence of parameters on the uniformity of abrasive trajectories. The results show that the eccentricity, arc chord length and speed ratio affect the probability of track coincidence rate, and then affect the distribution uniformity. And then the verification experiments solidifying the reliability of our kinematic model and affirming the veracity of simulation results. The best surface shape accuracy ( PV) of the MPCVD polycrystalline diamond wafer was 2.3 μm under optimal parameters, representing a substantial advancement compared to the original lapping method, which only yielded a PV value of 8.4 μm. This study provides a promising method for high surface shape accuracy of MPCVD polycrystalline diamond wafers with large sizes.

show abstract

Modeling and simulation method of trajectory in double-side autonomous grinding considering the dynamic friction coefficient

Cited by 4 publications

References 22 publications

Analysis of the Influence of the Motion State of Ultra-Thin Sapphire Based on Layer-Stacked Clamping (LSC)

Analysis of the Influence of the Motion State of Ultra-Thin Sapphire Based on Layer-Stacked Clamping (LSC)

Effect of the vibration displacement responses on end grinding processed surface height

Simulation and experimental research on the abrasive trajectories of plane lapping based on rotary swing drive

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