2019
DOI: 10.3390/en12101894
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Modelling a Switching Process of IGBTs with Influence of Temperature Taken into Account

Abstract: In this article the problem of modelling a switching process of Insulated Gate Bipolar Transistors (IGBTs) in the SPICE software is considered. The new form of the considered transistor model is presented. The model includes controlled voltage and current sources, resistors and voltage sources. In the model, influence of temperature on dc and dynamic characteristics of the IGBT is taken into account. A detailed description of the dynamic part of this model is included in the article and some results of experim… Show more

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Cited by 13 publications
(25 citation statements)
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“…The same research gives information, according to which the maximum overloading, therefore the probable failure, occurs mostly when high current and high voltage are simultaneously applied across the device during the switch-on or switch-off periods. Additionally, the dependency of IGBTs dynamic characteristic on the temperature can be verified with modeling and simulations [12][13][14]. The proposed models have applications in converter design, mode-of-operation analysis, lifespan estimation, analysis and design of the necessary cooling system, etc.…”
Section: Introductionmentioning
confidence: 78%
“…The same research gives information, according to which the maximum overloading, therefore the probable failure, occurs mostly when high current and high voltage are simultaneously applied across the device during the switch-on or switch-off periods. Additionally, the dependency of IGBTs dynamic characteristic on the temperature can be verified with modeling and simulations [12][13][14]. The proposed models have applications in converter design, mode-of-operation analysis, lifespan estimation, analysis and design of the necessary cooling system, etc.…”
Section: Introductionmentioning
confidence: 78%
“…Although the maximum collector conveyor for high voltage insulated gate bipolar transistor (HV-IGBT) reaches 6500 V, it cannot be integrated with some high-voltage power converters. The main issue of the serial-connected IGBTs is the voltage offset during the dynamic switching process [2]. The dynamic voltage offset methods for the serial-connected IGBTs can be categorized as passive control and active control.…”
Section: Introductionmentioning
confidence: 99%
“…SPICE contains a large number of passive and active device models. The accuracy of SPICE models for various semiconductor devices, such as MOSFET, BJT, SJT and IGBT transistors, has already been studied [13][14][15][16][17][18].…”
Section: Introductionmentioning
confidence: 99%