Modelling of ICA creep properties

Rusanen, Outi

doi:10.1109/adhes.2000.860597

Cited by 8 publications

(5 citation statements)

References 15 publications

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“…It is noted that impact failure is typically adhesive [6] despite correlating with the bulk loss modulus, and that commercial ICA adhesive strength is at least comparable to solder's. So evidently the mechanical performance advantage of ICAs versus solder predicted in [4] will only be achievable with improved adhesion.…”

Section: Discussionmentioning

confidence: 95%

“…In most cases, the failure mode was adhesive, rather than cohesive as assumed in the Rusanen modeling [4]. Pictures of matching fracture surfaces for a Batch A sample are shown in Fig.…”

Section: Adhesive Failurementioning

confidence: 98%

“…In the rare example of ambient temperature mechanical cycling [3], the failure criterion was based (as in [1]) on increased electrical resistivity, rather than mechanical failure. Rusanen simulated mechanical cycling of ICAs for comparison with Sn-Pb and no-Pb solder reliabilities in Coffin-Manson type plots of log cycles to failure versus log non-recoverable strain [4] and predicted superior performance by the ICAs, with reliability lifetimes approximately an order or more longer than solders' due to higher compliances. This project began as an attempt to verify these theoretical plots, which were based on cohesive failure simulations using experimental materials data obtained at room temperature.…”

Section: Introductionmentioning

confidence: 99%

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Interpretation of ICA mechanical cycling data

Morris

Niiranen

Mattila

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Cyclic mechanical shear testing of isotropic conductive adhesives (ICAs) at ambient temperature reveals both viscoelastic behavior and a reproducible stress plateau. The failure mechanism is typically adhesive, rather than cohesive, which leads to significant deviations from the Coffin-Manson behavior expected. Tentative explanations of the viscoelasticity and plateau are offered in terms of filler particle movement and structural layering within the epoxy matrix.

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Section: Discussionmentioning

confidence: 95%

“…In most cases, the failure mode was adhesive, rather than cohesive as assumed in the Rusanen modeling [4]. Pictures of matching fracture surfaces for a Batch A sample are shown in Fig.…”

Section: Adhesive Failurementioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

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Interpretation of ICA mechanical cycling data

Morris

Niiranen

Mattila

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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“…Therefore, for electronic devices, the evaluation of the fatigue life of the interconnects is important. [7][8][9][10] However, fatigue characteristics of the conductive adhesive and its fatigue damage mechanism have not been elucidated. For practical applications, the fatigue characteristics of the conductive adhesive must be elucidated.…”

Section: Introductionmentioning

confidence: 99%

Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint

et al. 2010

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The effects of temperature and dwell time on the low-cycle fatigue life of Ag-epoxy based conductive adhesive have been investigated by using a micro-joint specimen. The low cycle fatigue life of the conductive adhesive increases when test temperature is elevated beyond the glass transition point. On the other hand, the dwell time at 398 K reduces the fatigue life, which, however, is increased by the dwell time at 348 K. The cross-sectional image suggests the embrittlement of epoxy resin during the dwell time at 398 K, which reduces the fatigue endurance of the conductive adhesive. In contrast, some kind of recovery effects exists during dwell time near the glass transition temperature, which improves the fatigue life.

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“…[5] for glass/epoxy composites and Rusanen et a1. [6] for chip bonding. The first author presented a simple experimental law based on applied stress level for composites.…”

Section: Introductionmentioning

confidence: 99%

Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling

Sartor

Michel

et al. 2014

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and

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Isotropic conductive adhesives (ICA) are now widely used in industry for a panel of applications such as space electronics manufacturing. Epoxy based adhesives are compliant enough to reliably bond bi-materials with an important coefficient of thermal expansion (CTE) mismatch. However, they are still under investigation for the characterization of their fatigue behaviour. Engineers lack of life prediction tools, although they are available for metallic materials. It is all the more necessary when it comes to severe on-ground qualification tests used to accelerate the demonstration of the die attachment reliability.This study deals with an epoxy based ICA with 80 wt% of silver flakes. The objectives are to characterize the glass/amorphous behaviour of the adhesive and to investigate its numerical implementation in ABAQUS for the on-ground test temperatures.The adhesive viscoelasticity becomes more preponderant with increasing of the temperature. For the time being it has been characterized between 20°C and 50°C. Tensile and creeps tests have been performed in different conditions identification purposes. A viscoelastoplastic model called Two-layers has been fitted to experimental results with success to get the evolution of the material coefficients in function of temperature. The next step consists in the implementation of the complete adhesive behaviour in an ABAQUS 20 model of the microelectronic components in thermal cycling.

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Modelling of ICA creep properties

Cited by 8 publications

References 15 publications

Interpretation of ICA mechanical cycling data

Interpretation of ICA mechanical cycling data

Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint

Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling

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