1994
DOI: 10.1116/1.587379
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Modification of Si field emitter surfaces by chemical conversion to SiC

Abstract: Silicon field emitters have been modified by coating with a thin SiC film through a chemical conversion process. Silicon carbide was formed on Si emitter surfaces by reacting with ethylene gas at temperatures between 850 and 950 °C using pressures as high as 5×10−3 Torr. The thickness of the coatings ranged from 2 to 500 nm, determined by a combination of reaction time, pressure, and temperature. Stable emission currents above 10 μÅ were measured from individual SiC coated emitters.

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Cited by 9 publications
(3 citation statements)
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“…However, the growth of SiC on a nanometer scale Si emitter surface is especially challenging because of the 20% mismatch in lattice parameter between Si and SiC. 26 The one step fabrication technology, under consideration here, eliminates the need for any further encapsulation of the Si emitters. The process was further applied to other substrate materials such as GaAs, GaP, Al, and demonstrated similar nanotip arrays of respective materials capped under a SiC head, which will be reported separately.…”
mentioning
confidence: 99%
“…However, the growth of SiC on a nanometer scale Si emitter surface is especially challenging because of the 20% mismatch in lattice parameter between Si and SiC. 26 The one step fabrication technology, under consideration here, eliminates the need for any further encapsulation of the Si emitters. The process was further applied to other substrate materials such as GaAs, GaP, Al, and demonstrated similar nanotip arrays of respective materials capped under a SiC head, which will be reported separately.…”
mentioning
confidence: 99%
“…Several approaches have been taken to improve the stability of field-emitter arrays, namely the deposition of SiC, diamond and metal coatings on the silicon surface [3][4][5]. Hard material coatings such as SiC and diamond proved effective in protecting the silicon surface from oxide formation and gas reactions, but they increased the driving voltages of the FEA.…”
Section: Introductionmentioning
confidence: 99%
“…Diamonds as one of the broadband gap materials (such as c-BN, AlN, SiC, Al 2 O 3 and LiF, etc.) have attracted increasing attention [1][2][3][4][5][6][7][8][9][10] . All these materials have many merits such as excellent chemical, thermo stability, high melting point, thermal conductivity coefficient, small dielectric constant, high current carrier mobility ratio and high break-over voltage, especially, low electron affinity (EA).…”
mentioning
confidence: 99%