Modulation speed enhancement of directly modulated lasers using a micro-ring resonator

An, Yulong; Lorences-Riesgo, Abel; Seoane, Jorge; Ding, Yunhong; Ou, Haiyan; Peucheret, Christophe

doi:10.1109/oic.2012.6224461

Cited by 6 publications

(3 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The optical power associated with the ‘0’ symbol in the transmitted signal is therefore suppressed, resulting in a strong ER enhancement, which explains the absence of the expected power penalty. As is well known, the same effect can be obtained by using narrow‐bandwidth optical filters that reject the spectral components associated with the ‘0 ' symbols [7, 8]. However, this approach might be not desirable in PONs where no optical filters are present in the ODN and in the ONUs.…”

Section: Experiments and Resultsmentioning

confidence: 99%

Using directly modulated DFBs without power penalty in low‐cost and high‐power budget coherent access networks

et al. 2014

View full text Add to dashboard Cite

show abstract

Section: Experiments and Resultsmentioning

confidence: 99%

Using directly modulated DFBs without power penalty in low‐cost and high‐power budget coherent access networks

et al. 2014

View full text Add to dashboard Cite

show abstract

“…A chirp-managed silicon photonic transceiver is well suited for inter-datacenter and 25G-PON applications where small form factor pluggable transceivers are desirable. Although the filter was a commercial instrument, it can be replaced with a ring resonator with engineered spectrum similar to the work in [9,18,19]. The use of integrated DFB lasers creates a straightforward path to implement wavelength division multiplexing on the chip, allowing to increase the aggregate bitrate per transceiver chip.…”

Section: Discussionmentioning

confidence: 99%

10-/28-Gb Chirp Managed 20-km Links Based on Silicon Photonics Transceivers

Abbasi

Moeneclaey

Yin

et al. 2017

IEEE Photon. Technol. Lett.

View full text Add to dashboard Cite

High speed directly modulated single mode lasers are becoming important optical components for short reach communication. In order to cover a transmission distance that is required for PON and inter data-center applications, the chirp managed laser (CML) is an attractive transmitter technology. This technology enables to use a directly modulated laser (DML) for longer reach systems, resulting in a smaller footprint, low fabrication cost and lower power consumption. Error free 10 Gb/s non-return-to-zero-on-off-keying (NRZ-OOK) data transmission over 20 km standard single mode fiber (SMF) is demonstrated using a heterogeneously integrated III-V-on-Si distributed feedback laser in combination with a tunable optical filter as a transmitter and a Ge-on-Si waveguide-coupled Avalanche Photodiode (APD) with an integrated transimpedance amplifier (TIA) as a receiver. For inter-datacenter applications, by increasing the bias current of the laser (improving its modulation bandwidth and output power) and using a faster silicon-contacted germanium waveguide p-in photodetector with an integrated TIA, 28 Gb/s NRZ-OOK data transmission over 20 km standard single mode fiber is demonstrated..

show abstract

“…For instance, a low confinement factor shifts the gain saturation towards higher powers and, therefore, evanescent coupling is beneficial for high-power applications. On the other hand, a high confinement factor allows for short laser cavities, which is advantageous for high-speed applications such as directly modulated lasers (DML), chirp-managed lasers (CML) [22][23][24], or electro-absorption modulators (EAM). These are interesting applications for metro and access communication systems, which is the main reason for which we (at III-V Lab) favor III-V/silicon devices based on optical mode transfer.…”

Section: Bondingmentioning

confidence: 99%

Hybrid III-V/silicon lasers

et al. 2014

View full text Add to dashboard Cite

The lack of potent integrated light emitters is one of the bottlenecks that have so far hindered the silicon photonics platform from revolutionizing the communication market. Photonic circuits with integrated light sources have the potential to address a wide range of applications from short-distance data communication to long-haul optical transmission. Notably, the integration of lasers would allow saving large assembly costs and reduce the footprint of optoelectronic products by combining photonic and microelectronic functionalities on a single chip. Since silicon and germanium-based sources are still in their infancy, hybrid approaches using III-V semiconductor materials are currently pursued by several research laboratories in academia as well as in industry. In this paper we review recent developments of hybrid III-V/silicon lasers and discuss the advantages and drawbacks of several integration schemes. The integration approach followed in our laboratory makes use of wafer-bonded III-V material on structured silicon-on-insulator substrates and is based on adiabatic mode transfers between silicon and III-V waveguides. We will highlight some of the most interesting results from devices such as wavelength-tunable lasers and AWG lasers. The good performance demonstrates that an efficient mode transfer can be achieved between III-V and silicon waveguides and encourages further research efforts in this direction.

show abstract

Modulation speed enhancement of directly modulated lasers using a micro-ring resonator

Abstract: Abstract-A silicon micro-ring resonator is used to enhance the modulation speed of a 10-Gbit/s directly modulated laser to 40 Gbit/s, demonstrating a potentially integratable transmitter design for high-speed optical interconnects.

Cited by 6 publications

References 5 publications

Using directly modulated DFBs without power penalty in low‐cost and high‐power budget coherent access networks

Using directly modulated DFBs without power penalty in low‐cost and high‐power budget coherent access networks

10-/28-Gb Chirp Managed 20-km Links Based on Silicon Photonics Transceivers

Hybrid III-V/silicon lasers

Contact Info

Product

Resources

About