INTRODUCTIONResearch in high-speed, heterojunction bipolar transistors (HBTs) is driven by applications in highfrequency communications and radar. The HBTs, with layers lattice matched to InP substrates, presently show the best high-frequency performance. Such HBTs can have In 0.52 Al 0.48 As or InP emitters, In 0.53 Ga 0.47 As or GaAs 0.52 Sb 0.48 base layers, and InP or In 0.53 Ga 0.47 As collector layers. We will refer to such devices as InP-based HBTs. Their superior performance results from the high material qualities of In-based materials including high electron mobility, large ⌫-L energy separation, and low contact resistances. Unfortunately, InP substrates are expensive and are available only in smaller diameters (10 cm vs. 15 cm) than GaAs substrates. Further, large (10-cm) InP substrates are fragile and are readily broken during semiconductor manufacturing. There has been extensive progress reported regarding metamorphic growth of InAlAs/InGaAs high-mobility electron transistors (HEMTs) on GaAs substrates. 1,2 More recently, several groups 3,4 have reported InP-based HBTs grown on GaAs substrates using InGaP or InGaAs buffer layers. There the work has focused on the physical and electrical quality of the HBT epitaxial layers and the HBT electrical performance. Compared to HEMTs, HBTs have much larger active-device volumes, are fabricated in integrated circuits with larger scales of integration, and typically operate at much higher power densities. Therefore, for metamorphic HBTs, both crystal defect density and buffer-layer thermal conductivity are serious concerns.Here, we study the thermal characteristics of metamorphic buffer layers and compute the resulting HBT junction temperatures. For the first time, metamorphic HBTs with InP buffer layers are reported. The InP buffer layers offer significantly reduced junction temperatures for devices operating at high power densities.
GROWTHThe samples were grown using a Varian Gen II, molecular beam epitaxy system equipped with a valved phosphorous (P) cracker cell, a valved arsenic (As) cracker cell, and a valved antimony (Sb) cracker cell. Three buffer-layer materials were used for this study: InAlAs, AlGaAsSb, and InP. All were grown at 490°C, as measured by a pyrometer. The InAlAs and AlGaAsSb buffers were graded in composition from that matched to a GaAs lattice to that matched to an InP lattice. The AlGaAsSb buffer consisted of an AlAsSb/GaAsSb superlattice whose period was 50In 0.52 Al 0.48 As/In 0.53 Ga 0.47 As heterojunction bipolar transistors (HBTs) were grown metamorphically on GaAs substrates by molecular beam epitaxy. In these growths, InAlAs, AlGaAsSb, and InP metamorphic buffer layers were investigated. The InAlAs and AlGaAsSb buffer layers had linear compositional grading while the InP buffer layer used direct binary deposition. The transistors grown on these three layers showed similar characteristics. Bulk thermal conductivities of 10.5, 8.4, and 16.1 W/m K were measured for the InAlAs, AlGaAsSb, and InP buffer layers, as compared to the 69 ...