2009
DOI: 10.12693/aphyspola.116.806
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Molecular Beam Epitaxy Growth for Quantum Cascade Lasers

Abstract: The fabrication of quantum cascade lasers emitting at 9 µm is reported. The devices operated in pulsed mode at up to 260 K. The peak powers recorded at 77 K were over 1 W and the slope efficiency η ≈ 0.5-0.6 W/A per uncoated facet. This has been achieved by the use of GaAs/Al0.45Ga0.55As heterostructure, with the "anticrossed-diagonal" design. Double plasmon planar confinement with Al-free waveguide has been used to minimize absorption losses. The double trench lasers were fabricated using standard processing … Show more

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Cited by 18 publications
(25 citation statements)
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“…The above mentioned calculations were done at the electrical field of 48 kV/cm close to an esti− mated laser threshold. The active region doping was applied for only two barrier−QW pairs in the central part of each in− jector; it has been tested by us in the range of n i 0.4 -2.2×10 12 cm −2 per period [5,9]. The double−plasmon low− −loss Al−free waveguide was used for planar optical confinement [15].…”
Section: Methodsmentioning
confidence: 99%
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“…The above mentioned calculations were done at the electrical field of 48 kV/cm close to an esti− mated laser threshold. The active region doping was applied for only two barrier−QW pairs in the central part of each in− jector; it has been tested by us in the range of n i 0.4 -2.2×10 12 cm −2 per period [5,9]. The double−plasmon low− −loss Al−free waveguide was used for planar optical confinement [15].…”
Section: Methodsmentioning
confidence: 99%
“…There is a wide agreement that changes of the injector doping level in the range of few ten per cents are crucial [1,[4][5][6][7][8][9], though variations of about 10% may be acceptable [2,10].…”
Section: Introductionmentioning
confidence: 99%
“…The electronic band structure of QCL, calculated by solving the Schrödinger equation with position dependent ) GaAs layers. The details of the technology are given in earlier papers [5][6][7]. * effective mass is shown in Fig.1.…”
mentioning
confidence: 99%
“…After the wafer was thinned down to about 100µm, an alloyed AuGe/Ni/Au contact was deposited on the backside. The lasers were cleaved into bars of 1, 1.5 and 2mm length and the soldered epilayer down on copper submounts [6]. We have used indium soldering or direct Au/Au bonding.…”
mentioning
confidence: 99%
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